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综述了印制电路板(PCB)孔金属化技术及其发展趋势,根据目前PCB孔金属化工艺存在的主要问题,指出了孔金属化工艺改进的途径和研究的方向.

参考文献

[1] 建宁.亚洲PCB近况[J].电子工件与材料,1998(06):46.
[2] 辜信实.印制电路用覆铜箔层压板[M].北京:化学工业出版社,2002
[3] 毛尚良;黄杜森.现代表面处理技术[M].上海:上海科学技术出版社,1994
[4] Cheryl A Decket.Electroless Copper Plating A Review:Part Ⅰ[J].Plating and Surface Finishing,1995(02):48.
[5] 周金风.覆铜板微波集成电路孔金属化工艺[J].电子工艺技术,1995(02):18.
[6] 李元山,金杰.高密度多重埋孔印制板的设计与制造[J].电子工艺技术,2001(03):116-119.
[7] 葛瑞.表面安装和高密度印制线路板[J].印制电路与贴装,1999(07):43.
[8] 吴水清.印制电路镀前处理技术的最新发展[J].电镀与精饰,1989(05):20.
[9] 姜晓霞;沈伟.化学镀理论及实践[M].北京:国防工业出版社,2000
[10] Bladon JJ.;Lytle FW.;Sonnenberg W.;Robinson JN.;Philipose G.;Lamola A. .A PALLADIUM SULFIDE CATALYST FOR ELECTROLYTIC PLATING[J].Journal of the Electrochemical Society,1996(4):1206-1213.
[11] 刘燕萍.胶体钯量对非金属材料的金属覆层性能的影响[J].电镀与精饰,1997(03):29.
[12] 古林擀弥;佐佐日清美 .化学镀液和工艺[P].JP特开2000-212761,2000.
[13] 曾为民,曹经倩,吴纯素,吴荫顺.PCB高稳定性化学镀铜工艺研究[J].南昌航空工业学院学报(自然科学版),2001(01):46-48.
[14] 曾为民,吴纯素,吴荫顺.多元络合剂化学镀铜动力学参数的研究[J].材料保护,2001(06):24-25.
[15] 许盛光.化学镀铜溶液稳定机理的研究[J].电镀与精饰,1987(03):12.
[16] Oita M;Matsuoka M .Deposition rate and morphology of electroless copper film from solutions containing 2 2′dipyridy[J].Electrochimica Acta,1997,42(09):1435.
[17] Cheryl A Decket.Electroless Copper Plating A Review:Part Ⅱ[J].Plating and Surface Finishing,1995(02):48.
[18] Liude M.Plating and surface[J].Finishing,1981(03):46.
[19] Dradhan N;Krishna P G;Dsa S C .Influence of chloride ion on electrocrystallization of copper[J].Plating and Surface Finishing,1999,83(03):56.
[20] Sunghee Y;Morton S;Kea N .Rotating Ring-Disk Electrode Studies of Copper Electrodeposition Effect of Chloride Ion and Organic Additives[J].Plating and Surface Finishing,1994,81(12):65.
[21] 邓文;刘昭林;郭鹤桐 .印制电路板酸性光亮镀铜的研究[J].电镀与涂饰,1996,15(03):4.
[22] 刘烈炜,郭田炜,赵志祥.酸性镀铜添加剂及其工艺的发展回顾[J].材料保护,2001(11):19-20.
[23] Waston A .Acid Copper Electroplating Bath Containing Brightening and Leveling Additives[P].US:4376685,1983.
[24] Mayer Sylvia .Functional Fluid Additives for Acid Copper Electroplating Baths[P].US:4336114,1982.
[25] 祝大同.无卤化PCB基板材料的新发展(上)[J].印制电路信息,2001(03):13-17.
[26] 刘仁志.用于印制线路板的环保型材料和工艺[J].电镀与精饰,2002(01):8-11.
[27] 蔡积庆 .利用导电聚合物悬浮溶液的直接电镀工艺[J].电镀与环保,1999,19(02):10.
[28] Meyer H R;Nichols R J;Schoer D et al.The use of conducting polymers and colloids in the through hole plating of printed circuit boards[J].Electrochimica Acta,1994,39:1325.
[29] Nawefune H;Kanai T et al.Direct metallization using salfortion of thermosetting poly-phenylene ether resin laminate[J].Plating and Surface Finishing,1997,84(07):52.
[30] Pendleton;Phillip .Process For Preparing Nonconductive Substrates[P].US:5015339,1991.
[31] Thorn;Polakovic;Mosolf .Composition and Process for Preparing A Nonconductive Substrate For Electroplating[P].US 5389270,1995.
[32] 王丽丽.印制板直接电镀工艺[J].电镀与精饰,1998(06):10.
[33] 吴水清.印制电路板酸性镀铜光亮剂[J].电镀与精饰,1989(01):18.
[34] Wolski A M;Akitoshi O .Electrodeposited Copper Foil for Fine Pattern and Method for Procting the Same[P].US:5834140,1998.
[35] Frisby;Richard C .Copper Plating of Gravure Rolls[P].US:5417841,1995.
[36] 朱琼霞;杨富国.有机添加剂在酸性光亮镀铜工业中的应用[J].安徽化工,2000(02):24.
[37] 沈品华,张松华.2000型硫酸盐镀铜光亮剂的研制[J].电镀与环保,2000(06):15-16.
[38] 马忠信.影响酸性光亮镀铜层微观整平性的因素[J].电镀与环保,2001(05):37-38.
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