RTM和预浸料两种工艺共固化会形成一个界面层,采用差热分析和红外光谱研究环氧树脂/酸酐和环氧树脂/双氰胺共固化体系的反应,采用正电子湮没技术测试了共固化体系所形成界面中的自由体积尺寸和浓度.结果表明,单独体系的反应峰大约是1 60℃,两种工艺树脂混合后,反应峰向高温方向移动,为275.14℃；同时放热量从RTM体系的236.2 J/g和预浸料体系的193.9 J/g降低至83.15 J/g;界面层的自由体积尺寸和浓度比两个单独固化体系的大,弯曲强度分别从RTM体系的140.2 MPa和预浸科体系的105.4MPa降至83.4 MPa.两种体系的固化剂相互反应,致使共固化体系反应不完全,形成一个力学性能较低的共固化界面层.
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