在C/SiC复合材料板上钻直径和深度不同的盲孔,模拟材料表面下的孔洞缺陷.利用红外热波检测技术对C/SiC缺陷试样盲孔缺陷的孔径和深度做定量检测,并与X射线照相及CT检测结果相比较.结果表明:红外热波检测适合C/SiC复合材料内部缺陷的检测,可同时定量检测C/SiC复合材料中缺陷的大小和深度,并能弥补X射线照相及CT检测的不足.缺陷直径测量误差随着缺陷孔径的增大而减小,随着缺陷深度的增加而增大;缺陷深度测量误差随着缺陷孔径的增大而减小,但在一定范围内随着缺陷深度的增加而减小.红外热波检测C/SiC复合材料孔洞缺陷存在定量测量的下限.
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