电流密度为3×103 A/cm2和环境温度100 ℃的实验条件下,在Cu/共晶SnBi焊点/Cu焊点的阴极和阳极Cu基板上都发现了晶须的生长.经EDX检测可知,其成分为Sn-Bi的混合物.抛光后发现,大量的Cu6Sn5金属间化合物附着在Cu基板上.结果表明:随着通电时间的延长,SnBi钎料在电迁移的作用下发生了扩散迁移,在Cu基板上形成了薄薄的钎料层.在焦耳热和环境温度的作用下,钎料层中的Sn与Cu基板中的Cu反应生成了大量的Cu6Sn5金属间化合物.这些金属间化合物的形成导致在钎料层的内部形成了压应力.为了释放压应力,Sn-Bi钎料以晶须的形式被挤出.
参考文献
| [1] | Tu K N;Chen Chih;Wu A T .[J].Journal of Materials Science:Materials in Electronics,2007,18:269. |
| [2] | Chuang Tunghan;Yen Shiufang .[J].Journal of Electronic Materials,2006,35(08):1621. |
| [3] | Lin Y W;Lai Yishao;Lin Y L et al.[J].Journal of Electronic Materials,2008,37(01):17. |
| [4] | Yuki Fukuda;Michael Osterman;Michael Pecht .The impact of electrical current, mechanical bending, and thermal annealing on tin whisker growth[J].Microelectronics and reliability,2007(1):88-92. |
| [5] | Xu Luhua;John Pang H L.[A].San Diego:ECTC,2006:1154. |
| [6] | Kuo Ning Chiang;Chien Chen Lee;Chang Chun Lee .[J].Applied Physics Letters,2006,88:580. |
| [7] | Zhang L;Wang Z G;Shang J K .[J].Scripta Materialia,2007,56:381. |
| [8] | Lin Y W;Lai Yishao;Lin Y L et al.[J].Journal of Electronic Materials,2008,37(01):17. |
| [9] | Hu Chichang;Tsai Yida;Lin Chicheng et al.[J].Journal of Alloys and Compounds,2009,472:121. |
| [10] | Miao Huiwei;Duh Jenqgong .[J].Materials Chemistry and Physics,2001,71:255. |
| [11] | Dong Wenxing;Shi Yaowu;Xia Zhidong et al.[J].Journal of Electronic Materials,2008,37(07):982. |
| [12] | Chen Chihming;Chen Longtai;Lin Yashiu .[J].Journal of Electronic Materials,2007,36(02):168. |
| [13] | 陈志刚.Investigation of Creep Behavior of SnAgCu Soldered Joints(SnAgCu钎焊接头蠕变行为研究)[M].北京:北京工业大学,2003 |
| [14] | Z.G. Chen;Y.W. Shi;Z.D. Xia;Y.F. Yan .Study on the Microstructre of a Novel Lead-Free Solder Alloy SnAgCu-RE and Its Soldered Joints[J].Journal of Electronic Materials,2002(10):1122-1128. |
| [15] | 何洪文;徐广臣;郝虎 et al.[J].Electronic Components & Materials(电子元件与材料),2007,26(11):53. |
| [16] | He Hongwen;Xu Guangchen;Hao Hu.[A].Shanghai:ICEPT,2007:225. |
| [17] | Galyon George T;Palmer L .[J].IEEE Transactions on Electronics Packaging Manufacturing,2005,28(01):17. |
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