采用金相显微镜(OM)、扫描电镜(SEM)和高分辨透射电镜(HRTEM)对Cu-4Ti-0.05RE和Cu-4Ti-0.12Zr-0.05RE两种合金的微观组织进行观察.对比分析发现添加Zr元素会抑制时效过程中形成片层组织(即延缓过时效的发生);两种合金在峰值时效时析出相均为亚稳的β′-Cu4Ti相,而在过时效状态下均会出现稳定的β-Cu3Ti相.采用显微硬度计和电导率测试仪分别研究两种合金在时效过程中显微硬度和电导率的变化规律.发现Cu-4Ti-0.05RE合金在450℃, 6 h达到峰值时效,此时合金的显微硬度HV是3150 MPa,电导率是11.99 %IACS;而Cu-4Ti-0.12Zr-0.05RE合金在450℃, 8 h达到峰值时效,此时合金的显微硬度HV是3350 MPa,电导率是11.41%IACS.
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