Tunable Reactive Wetting of Sn on Microporous Cu Layer

材料科学技术（英）, 2012, 28(4): 379-384.

Tunable Reactive Wetting of Sn on Microporous Cu Layer

^1, , ^2, , ^3, , ^4,

1.Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang110016, China

2.Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang110016, China

3.Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang110016, China

4.Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang110016, China

基金项目: Acknowledgements This work was supported by the National Natural Science Foundation of China(Grant 50501022) the National Basic Research Program of China(Grant 2010CB631006)

关键词：反应润湿 , 微孔 , 铜层 , 可调 , 微观结构 , 冶金反应 , 润湿性 , 锡

Tunable Reactive Wetting of Sn on Microporous Cu Layer

Keywords： Wetting , Porous material , Soldering ,

Wetting of microporous Cu layer by liquid Sn resulted in contact angles from 0 to 33 deg., tunable by varying wetting temperature and porous microstructure. The wetting was dominated by the interracial metallurgical reaction, which can lead to pore closure phenomenon, as the liquid infiltration facilitating the wetting process.

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