欢迎登录材料期刊网

材料期刊网

高级检索

低熔点合金/聚合物复合材料是一类新型的功能复合材料.其中的低熔点合金可以在聚合物加工的温度范围内转变为液态,为在加工过程中实现填料的形态转变和导电复合材料中导电通道的设计提供了可能.概述了以低熔点合金为导电填料的导电塑料和导电胶粘荆的研究进展,其中有关低熔点合金在加工过程中的尺寸和形态变化的研究工作值得关注.此外,还概述了低熔点合金/聚合物的流变性质的研究情况.最后指出了研究中存在的问题和有待继续深入研究的方向.

The composites consisting of low-melting-point alloy and polymer is a novel kind of functional composite. In this kind of composite low-melting-point alloy can be transformed from solid into liquid in the range of processing temperature of polymers,which provides a possibility to change form and size of fillers during processing and design electrically conductive path in composite. The progress of studying on electrically conductive plastics and adhesives containing low-melting-point alloy as conductive filler is reviewed. The present research on theological behavior of low-melting-point alloy/polymer is mentioned as well. In the end the deficiency in present studies on low-melting-point alloy/polymer composite and directions to further research are indicated.

参考文献

[1] 龚文化,曾黎明.聚合物基导电复合材料研究进展[J].化工新型材料,2002(04):38-40.
[2] 益小苏.复合导电高分子材料的功能原理[M].北京:国防工业出版社,2004
[3] 王红敏,晋圣松,唐国强,韩菲菲,梁旦,徐学诚.聚噻吩/多壁碳纳米管复合材料的导电性能[J].化学学报,2007(24):2923-2928.
[4] Kim DO;Lee MH;Lee JH;Lee TW;Kim KJ;Lee YK;Kim T;Choi HR;Koo JC;Nam JD .Transparent flexible conductor of poly(methyl methacrylate) containing highly-dispersed multiwalled carbon nanotube[J].Organic electronics,2008(1):1-13.
[5] 莫尊理,史华锋,陈红,牛贵平,吴迎冰,赵仲丽.纳米石墨薄片/聚苯胺-g-聚乙二醇复合材料及导电性能[J].功能材料,2009(01):154-158.
[6] 莫尊理,左丹丹,陈红,孙银霞,张平.纳米石墨薄片/聚吡咯复合材料的制备及导电性能[J].无机化学学报,2007(02):265-269.
[7] 王文平,刘燕,王斌,王平华.聚甲基丙烯酸甲酯/膨胀石墨纳米导电复合材料的制备与表征[J].高分子材料科学与工程,2006(06):209-212.
[8] Sasha Stankovich;Dmitriy A Dikin .Graphene-based composite materials[J].Nature,2006,442:282.
[9] 杨永岗,陈成猛,温月芳,杨全红,王茂章.氧化石墨烯及其与聚合物的复合[J].新型炭材料,2008(03):193-200.
[10] Ansari, S;Giannelis, EP .Functionalized Graphene Sheet-Poly(vinylidene fluoride) Conductive Nanocomposites[J].Journal of Polymer Science, Part B. Polymer Physics,2009(9):888-897.
[11] 赵泽卿;陈小立.高分子材料导电和抗静电技术及应用[M].北京:中国纺织出版社,2006
[12] 贺江平;邓建国.纳米铜/聚苯乙烯复合材料的制备、结构形态和性能[A].四川成都,2007
[13] 巴塔查里亚 S K;杨大川;刘美珠.金属填充聚合物--性能和应用[M].北京:中国石化出版社,1992:139.
[14] 郦华兴;王松林 .金属填充导电高分子材料研究进展[J].中国塑料,1995,13(01):18.
[15] 周秀芹.导电电磁屏蔽塑料研究新进展[J].化工时刊,2006(01):62-64.
[16] 何益艳,杜仕国,姜志博.电磁屏蔽导电塑料的研究进展[J].材料导报,2003(02):49-51.
[17] 刘静,潘颐,张向武.Sn-Pb合金填充聚合物导电复合材料的PTC效应[J].复合材料学报,2002(06):116-119.
[18] Yi XS.;Shen L.;Pan Y.;Zhang XW. .Electrical properties of polymer/low-melting-point alloy binary systems[J].Polymer-Plastics Technology and Engineering,2000(5):829-833.
[19] Zhang Xiangwu;Pan Yi;Shen Lie et al.A novel low-melting-point alloy-loaded polymer composite.I.Effect of processing temperature on the electrical properties and morphology[J].Journal of Applied Polymer Science,2000,77:1044.
[20] Zhang Xiangwu;Pan Yi;Shen Lie et al.Novel low-melting-point alloy-loaded polymer composite.Ⅱ.Resistivity-temperature behavior[J].Journal of Applied Polymer Science,2000,77:756.
[21] Bormashenko Edward.Development of a novel composite based on polyethylene and low-melting-point metal alloy[A].Seattle,Washington,USA,2002:465.
[22] Bormashenko Edward .Development of novel binary and ternary conductive composites based on polyethylene,low-melting-point metal alloy and carbon black[J].Journal of Thermoplastic Composite Materials,2004,17(05):245.
[23] Borrnashenko E .Novel method of low-melting metal mieropowders fabrication[J].Journal of Materials Processing Technology,2005,168:367.
[24] 熊传溪,闻荻江.聚丙烯-锡复合材料的研究[J].复合材料学报,1999(03):40-45.
[25] 熊传溪;闻荻江 .LMPM/PP原位复合材料微纤结构的形成[J].材料导报,1998,12(03):60.
[26] XIONG Chuanxi;YANG Xiaoli;WEN Dijiang .Dispersion and in situ formed fiber of low melting point metals in polymer[J].Journal of Wuhan University of Technology. Materials Science,1998(4):36-41.
[27] 熊传溪;闻荻江 .LMPM/PP复合材料中PP的晶型结构[J].中国塑料,1999,13(04):24.
[28] 熊传溪,杨小利,余剑英,闻荻江.LMPM/PP原位复合材料的力学强度[J].武汉工业大学学报,1999(04):13-15.
[29] 熊传溪,闻荻江.LMPM/PP复合材料的导电性能[J].功能高分子学报,1998(04):467-472.
[30] 孙义明,孟庆浩,彭少贤,杨宇红,刘伟.低熔点双组分合金填充聚烯烃结晶性能研究[J].现代塑料加工应用,2004(04):4-6.
[31] 孙义明,孟庆浩,彭少贤,杨宇红.低熔点双组分合金填充HDPE导电性能研究[J].现代塑料加工应用,2004(05):9-10.
[32] 贺江平,唐明静,王宪忠,芦艾.不同加工条件下Sn-Cu/HDPE复合体系中填料相的形态特点[C].2008年全国高分子材料科学与工程研讨会论文集,2008:520-521.
[33] 王德禧,刘萍.塑料新材料进展与加工助剂[J].国外塑料,2005(07):24-39.
[34] Daoqiang Lu;C. P. Wong .Isotropic Conductive Adhesives Filled with Low-Melting-Point Alloy Fillers[J].IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society,2000(3):185-190.
[35] Lu Daoqiang.Development of conductive adhesives filled with low-melting-point alloy fillers[A].Piscataway,2000:7.
[36] Jong-Min Kim;Kiyokazu Yasuda;Masahiro Rito .New Electrically Conductive Adhesives Filled with Low-Melting-Point Alloy Fillers[J].Materials transactions,2004(1):157-160.
[37] Yasuda Masahiro.Self-organized joining assembly process by electrically conductive adhesive using low melting point fillers[A].,2004:183.
[38] Yasuda;Kiyokazu;Ohta.Self-organized packaging using polymer containing low-melting point metal filler[A].,2005:239.
[39] Wu J;Moon K;Wong C P.Self-alignment feasibility study and contact resistance improvement of electrically conductive adhesives[A].Orlando(USA),2001:571.
[40] Moon K S;Wu J;Wong C P.Study on self-alignment capability of electrically conductive adhesives for flip-chip application[A].Braslton,2001:341.
[41] Kyoung-Sik Moon;Jiali Wu;C. P. Wong .Improved stability of contact resistance of low melting point alloy incorporated isotropically conductive adhesives[J].IEEE transactions on components and packaging technologies: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society,2003(2):375-381.
[42] Yasuda Kiyokazu;Kim Jong-Min;Fujimoto kozo .Adhesive joining process and joint property with low melting point filler[J].Journal of Electron Packag Trans ASME,2005,127(01):12.
[43] Yasuda Kiyokazu;Kim Jong-Min;Yasuda Masahiro et al.New process of self-organized interconnection in packaging using conductive adhesive with melting point filler[J].Japanese Journal of Applied Physics Part 1:Regular Papers and Short Notes and Review Papers,2004,43(04):2277.
[44] Yong;Sung Eom;Keonsoo Jang;Jong;Tae Moon;Jae;Do Nam;Jong;Min Kim .Electrical And Mechanical Characterization Of An Anisotropic Conductive Adhesive With A Low Melting Point Solder[J].Microelectronic engineering,2008(11):2202-2206.
[45] Yong-Sung Eom;Ji-Won Baek;Jong-Tae Moon;Jae-Do Nam;Jong-Min Kim .Characterization of polymer matrix and low melting point solder for anisotropic conductive film[J].Microelectronic engineering,2008(2):327-331.
[46] Jin Woon Lee;Seong Hyuk Lee;Jong-Min Kim .Numerical Investigation on Self-Organized Interconnection Using Anisotropic Conductive Adhesive with Low Melting Point Alloy Filler[J].Materials Transactions,2008(11):2572-2578.
[47] 液态锡及锡铅合金对聚丙烯的促流作用[J].中国有色金属学报,1999(02):268.
[48] Zhang Xiangwu;Pan Yi;Cheng Jianfeng et al.The influence of low-melting-point alloy on the rheological properties of a polystyrene melt[J].Journal of Materials Science,2000,35:4573.
[49] Defeng W U;Lanfeng W U .Poly(phenylene sulfide)/low-melting-point metal composites.I.transient viscoelastic properties and crystallization kinetics[J].Journal of Polymer Science Part B:Polymer Physics,2008,46:677.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%