采用熔滴直接凸点制作方法,对共晶SnPb及SnAgCu钎料熔滴与Au/Ni/Cu焊盘所形成的凸点/焊盘界面组织进行了研究,并与激光重熔条件下获得的凸点/焊盘界面组织进行了比较,考察了凸点/焊盘界面组织在随后的再重熔过程中的演变.结果表明:钎料熔滴与焊盘在接触过程中形成了Au-Sn化合物,Au层并未完全反应.在随后的再重熔过程中,Au层被完全消耗,全部溶入钎料基体中,Ni层与钎料发生反应.无铅钎料(SnAgCu)和SnPb钎料所形成的界面组织明显不同;再重熔后SnPb钎料/焊盘的界面组织为Ni3Sn1,SnAgCu钎料/焊盘界面组织为(CuxNi1-x)6Sn5.
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