概述了近年来微波InGaP/GaAs异质结双极晶管(HBT)器件和集成电路的研究和应用现状,着重阐述了HBT器件的热设计、降低偏移电压、离子注入隔离、湿法腐蚀,以及用于电路设计的等效电路模型等关键问题.
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