在含硅芳炔树脂（PSA）中加入活性稀释剂制备了低黏度含硅芳炔树脂，研究低黏度PSA的流变性能和固化工艺，固化PSA树脂的热性能、力学性能和电气性能。结果表明：PSA中加入稀释剂可以显著降低其黏度，PSA树脂在氮气和空气中的5%热失重温度分别可达665.5℃和603.3℃，800℃残留率分别达到89.7%和53.8%；PSA树脂的玻璃化转变温度高于500℃；加入10%质量分数稀释剂的PSA树脂的弯曲强度可达到30 MPa，弯曲模量变化不大，25℃下在101~106 Hz内介电常数和介质损耗角正切分别小于3.24和0.005。
A low viscosity silicon-containing arylacetylene resin(PSA) was prepared by adding reactive dilu-ent to PSA, and the rheological property and curing process of the viscosity PSA, the thermal property, mechanical properties, and dielectric properties of the cured PSA were studied. The results show that the addition of reactive diluent to PSA could make its viscosity decrease siginificantly. The thermal decompo-sition temperatures at 5% weight loss of the cured PSA reach 665.5℃ in nitrogen and 603.3℃ in air, and its residual rate at 800℃ is 89.7% and 53.8%, respectively. The glass transition temperature of the cured PSA is higher than 500℃. The bending strength of the PSA attains 30 MPa after adding 10% of reactive diluent, the bending modulus changes little, and the permittivity and loss tangent are less than 3.20 and 0.005 at 25℃ ranging from 101 Hz to 106 Hz.
参考文献
| [1] | Itoh M.;Iwata K.;Mitsuzuka M.;Kakigano T.;Inoue K. .NEW HIGHLY HEAT-RESISTANT POLYMERS CONTAINING SILICON - POLY(SILYLENEETHYNYLENEPHENYLENEETHYNYLENE)S[J].Macromolecules,1997(4):694-701. |
| [2] | Buvat P;Jousse F;Delnaud L.Synthesis and Proper-ties of New Processable Type Polyarylacettylenes[A].,2000:134-144. |
| [3] | Fan Wang;Jian Zhang;Jianxiang Huang;Hao Yan;Farong Huang .Synthesis and Characterization of Poly(dimethylsilylene ethynylenephenyleneethynylene)Terminated with Phenylacetylene[J].Polymer bulletin,2006(1):19-26. |
| [4] | Canfeng Wang;Farong Huang;Yun Jiang .A Novel Oxidation Resistant SiC/B_4C/C Nanocomposite Derived from a Carborane-Containing Conjugated Polycarbosilane[J].Journal of the American Ceramic Society,2012(1):71-74. |
| [5] | Ye L;Han WJ;Zhang RL;Hu JD;Zhao T .Synthesis, Characterization, and Properties of Silylene-Acetylene Preceramic Polymers[J].Journal of Applied Polymer Science,2008(6):4064-4070. |
| [6] | Kyushin S;Shiraiwa H;Kubota M et al.Poly[(silylyne)ethy-nylene] and Poly[(silylene)ethynylene]:New Precursors for the Efficient Synthesis of Silicon Carbide[J].Ceramic transactions,2010,213:3-6. |
| [7] | Antipov O L;Domrachev G A;Douglas W E et al.Degen-erate Four-wave Mixing Measurements of the χ(3)Non-lin-earOptical Properties of Poly(arylene-ethynylenesilylene)s[J].Applied Organometallic Chemistry,2000,14(10):640-643. |
| [8] | Itoh M.;Inoue K.;Hirayama N.;Sugimoto M.;Seguchi T. .Fiber reinforced plastics using a new heat-resistant silicon based polymer[J].Journal of Materials Science,2002(17):3795-3801. |
| [9] | 郑芸,金晓林,段景宽,江平开.反应性硅氧烷改性VPI环氧树脂的研究[J].绝缘材料,2008(04):1-5,8. |
| [10] | Shim I W;Risen W M .Synthesis and Spectral Study of Low Dimensional Poly-yne Polymers Containing Phthalocy-anine Silicon and Dimethyl Silicon in the Polymer Back-bone[J].J Organmet Chem,1984,260(2):171-179. |
| [11] | Corriu R J P;Douglas W E;Yang Z X .Synthesis of Poly(alkynylsilanes)having Various Aromatic Groups in the Backbone[J].J Polym Sci Part C Polym Lett,1990,28:431-437. |
| [12] | Itoh M;Mitsuzuka M;Iwata K et al.A Novel Synthesis and Extremely High Thermal Stability of Poly[(phenylsi-ly1ene)-ethynylene-l,3-phenyleneethynylenel[J].Macromole-cules,1994,27:7917-7919. |
| [13] | Tseng, WC;Chen, Y;Chang, GW .Curing conditions of polyarylacetylene prepolymers to obtain thermally resistant materials[J].Polymer Degradation and Stability,2009(12):2149-2156. |
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