研究了LTCC(低温共烧玻璃-陶瓷)N2气氛下基片排胶效果与铜布线质量.用综合热分析仪分析了LTCC基片N2烧结,发现有机物的排放集中在150～500℃区段;烧结试样微观断面形貌及能谱分析表明,干N2烧结后,基片中残留许多游离C,严重影响了基片强度及基片与Cu布线的界面结合;湿N2烧结后,基片排胶完全,但Cu布线发生了较为严重的氧化.
参考文献
| [1] | Kamehara N;Kurihara K;Niwa K .Method for Producing Multilayers Glass-Ceramic Structure with Copper-Based Conductors Therein,(Fujitsu,Ltd,)[P].U S Pat No.4 504 339,1985. |
| [2] | Master R.N.;Herron L.W. .Cosintering process for glass-ceramic/copper multilayer ceramic substrate[J].IEEE transactions on components, hybrids, and manufacturing technology,1991(4):780-783. |
| [3] | Master Rai N;Tumrnala R R .[J].IEEE Transactions on Components Packaging and Manufacturing Technology,1991,14(04):780-783. |
| [4] | 梁彤翔 .细线W浆料的研制和AlN/W多层共烧金属化[D].清华大学,1996. |
| [5] | Jean Jau-Ho;Chang Chia-Ruey .[J].Journal of Materials Research,1997,12:2743-2750. |
| [6] | Tummala R R .[J].Journal of the American Ceramic Society,1991,74(05):895-908. |
| [7] | Tummala R R.Microelectronic Packaging Handbook[M].Van Nostrand-Reinhold,N Y:353. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%