对Cu-6%Ag(质量分数,下同)合金固溶后在350和450℃时效不同时间,观察了时效处理前后显微组织及测定了不同时效状态下合金的硬度和电导率.在350 ℃时效1 h及450 ℃时效15 min时,过饱和固溶体晶界附近即可明显析出次生Ag相并形成不连续析出区.随时效时间延长,不连续析出区域扩大及次生Ag相颗粒粗化.在350和450 ℃时效时,硬度达到峰值的时间分别为32及2 h,电导率达到峰值的时间分别为128和8 h.450 ℃时效的合金峰值硬度和峰值电导率高于在350 ℃时效的合金.在时效前期,较高温度的析出过程对提高合金硬度和电导率的效果比较明显,而在时效后期,较低温度析出过程对合金硬度和电导率的提高更为明显.
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