欢迎登录材料期刊网

材料期刊网

高级检索

制备了烯丙基化程度可达173%的烯丙基酚醛树脂(AN173),并与双马来酰亚胺(BMI)以1:1的质量比进行共聚,制备了双马改性的烯丙基酚醛树脂(BMAN173).研究了该树脂工艺性,确定了其固化制度,考察了该树脂石英布复合材料层合板的耐热性和力学性能.实验结果表明,BMAN173树脂具有良好的工艺性,适合于RTM、模压成型等多种成型工艺.BMAN173树脂固化物表现出良好的耐热性,其储能模量起始下降温度约为390℃,起始热分解温度超过430℃.与传统酚醛树脂相比,该树脂的复合材料的高温力学性能优异,350℃弯曲强度和层间剪切强度保留率分别约为57%和62%;复合材料具有优异的热性能,其储能模量起始下降温度约为410℃,玻璃化转变温度超过了450℃.BMAN173树脂是耐高温复合材料的理想候选基体树脂.

参考文献

[1] Kopf P W,Little A D.Phenolic resins[M]//4th ed.Mark H E,Bikales N M.Encyclopedia of Polymer Science and Engineering.New York:John wiley,1988:45-50.
[2] Reghunadhan Nair C P.Recent developments in phenolic resins,addition-cure phenolics[C]// Ghosh A K.Proceedings of Polymers 99,International Symposium on Polymers Beyond AD 2000.New Delhi:Society of Polymer Science,1999:35-52.
[3] Bindu R L,Reghunadhan Nair C P,Nair K N.Phenolic resin bearing maleimide groups:Synthesis and characterization[J].J Polym Sci Polym Chem,2000,38(3):641-652.
[4] Gu A J,Liang G Z,Lan L W.Modification of polyaralkylphenolic resin and its copolymer with hismaleimide[J].J Appl Polym Sci,1996,59(6):975-979.
[5] Gouri C,Reghunadhan Nair C P,Ramaswamy R.Reactive alder-ene blend of diallyl bisphenol A novolac and bisphenol A bismaleimide:Synthesis,cure and adhesion studies[J].Polym Int,2001,50(4):403-413.
[6] Reghunadhan Nair C P,Bindu R L,Ninan K N.Bis propargyl ether resins:Synthesis and structure thermal property correlations[J].European Polymer Journal,1999,35(2):235-246.
[7] Wang M C,Wei L H,Zhao T.Addition-curable propargylcontaining novolac-type phenolic resin:Its synthesis,characterization,cure,and thermal properties[J].J Appl Polym SCi,2006,99(3):1010-1017.
[8] Ambika D K,Reghunadhan C P,Ninan K N.Dual cure phenol epoxy resins,characterisation and properties[J].Polym Polym Compos,2003,11(7):1-8.
[9] Reghunadhan Nair C P,Bindo R L,Ninan K N.Phenyl ethynyl functional addition cure phenolic resins:Synthesis,characterization and thermal properties[J].Journal of Materials Science,2001,36(13):4151-4157.
[10] Savoskin V M,Gontarevskaya N P,Borbulevich A I,Protsenko E I,Lunev L V.Synthesis of allyl derivatives of phenols[J].Plast Massy,1984,6(1):10-11.
[11] Friedrich L,Charles E M.Process for the preparation of di and poly-allyl ethers:US,4433,179[P].1984-02-21.
[12] Yan Y H,Shi X M,Liu J G.,Zhao T,Yun Y Z.Thermosetting resin system based on novolak and bismaleimide for resin-transfer molding[J].J Appl Polym Sci,2002,83(8):1651-1657.
[13] Yao Y,Zhao T,Yu Y Z.Novel thermosetting resin with very high glass transition temperature based on bismaleimide and allylated novolae[J].J Appl Polym Sci,2005,97(3):443-448.
[14] 席洪安,刘润山.烯丙基醚化酚醛树脂/双马来酰亚胺共聚物性能研究[J].高分子材料科学与工程,1998,14(4):117-119.Xi Hong'an,Liu Runshan.Properties of bismaleimide-allyl etherified novolac copolymers[J].Polymer Materials Science and Engineering,1998,14(4):117-119.
[15] 梁国正,顾媛娟,李秀仪,李新云,蓝立文.烯丙基线性酚醛树脂改性BMI的研究[J].纤维复合材料,1996,22(2):22-24.Liang Guozheng,Gu Yuanjuan,Li Xiuyi,Li Xinyun,Lan Liwen.Study on composites based on bismaleimide resin modified by allyl novolac[J].Fiber Reinforced Plastics/Composites,1996,22(2):22-24.
[16] Luo Z H,Liu F,Wei L H,Zhao T.Study on BMI modified allyl-functional novolac resin/silica cloth composites:Effect of allylation degree on thermal and mechanical properties[J].Polymer Composites,2007,28(2):180-185.
[17] Wang P C.Bismaleimide-containing thermosetting composition:Europe,0352686A1[P].1989-07-27.
[18] Szymenski H A,Bloemli A.Study of phenolic resins by NMR spectroscopy with arsenic trichloride as a solvent[J].J Polym Sci Part A:Polym Sci,1965,3(1):63-74.
[19] 王明存,魏柳荷,赵彤.新型酚醛树脂MPN作为复合材料基体的评价[J].复合材料学报,2006,23(2):36-41.Wang Mingcun,Wei Liuhe,Zhao Tong.Evaluation of novel phenolic resin MPN as the matrices of composite materials[J].Acta Materiae Compositae Sinica,2006,23(2):36-41.
[20] Edwin P P.Interfaces in polymer matrix composites[M].New York:Academic Press,1974:65-67.
[21] 闫业海,刘金阁,赵彤,余云照.一种适用于树脂传递模塑工艺的双马来酰亚胺改性酚醛树脂[J].高技术通讯,2002,43(5):56-59.Yan Yehai,Liu Jinge,Zhao Tong,Yu Yunzhao.A bismaleimide modified phenolic resin system for resin transfer molding[J].Chinese High Technology Letters,2002,43(5):56-59.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%