Diffusion Bonding of Tungsten to Copper and Its Alloy with Ti Foil and Ti/Ni/Ti Multiple Interlayers

材料科学技术（英）, 2003, 19(z1): 189-192.

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1.Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China

2.Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China

3.Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China

4.Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China

5.Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China

6.Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China

7.Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China

Diffusion Bonding of Tungsten to Copper and Its Alloy with Ti Foil and Ti/Ni/Ti Multiple Interlayers

Keywords： Tungsten

Ti foil and Ti/Ni/Ti multiple interlayers were selected for the bonding of tungsten to copper and CuCrZr alloy. Theeffects of processing conditions on the microstructures and shear strength of the joints were investigated.

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Diffusion Bonding of Tungsten to Copper and Its Alloy with Ti Foil and Ti/Ni/Ti Multiple Interlayers

参考文献