通过对聚酰亚胺薄膜绕包铜扁线的工艺研究，分析了聚酰亚胺薄膜绕包铜扁线的耐电晕性能。结果表明：影响聚酰亚胺薄膜绕包铜扁线耐电晕性能的主要因素为烧结温度、绕包张力和红外辐射炉温度。当烧结温度为230℃,绕包张力为8 N，红外辐射炉温度为450℃时，聚酰亚胺薄膜绕包铜扁线的耐电晕性能最佳。
The corona-resistance of flat copper wire winded by polyimide film was analyzed by studying the technology of the flat copper wire. The results show that the main factors influencing the corona-resis-tance are sintering temperature, winding tension and infrared radiation oven temperature. When the sinter-ing temperature is 230℃, winding tension is 8 N, infrared radiation oven temperature is 450℃, the coro-na-resistance of the flat copper wire winded by polyimide film is optimum.
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