用磁控溅射法将NiTi薄膜沉积在纯Cu箔片上,在800℃分别固溶30 min,45 min,60min和120 min;采用X射线傅氏线形分析法计算各固溶时间的位错密度及位错分布参量.随固溶时间的增加,平均位错密度不断下降;亚晶粒尺寸D逐渐增加;平均位错分布参量基本不变.由位错密度及位错分布参量计算得到NiTi薄膜材料的显微硬度值,随固溶时间的增加,显微硬度计算值明显低于测量值.
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