采用喷射沉积技术制备了新型电子封装材料70%Si-Al合金, 对其进行热等静压致 密化处理后, 测试了合金的主要性能. 结果表明: 喷射沉积70%Si-Al合金的密度低, 组织细小均匀, 各向同性, Si相粒子尺寸在10-20 μm之间且弥散分布. 新 型70%Si-Al合金具有与Si和GaAs等半导体材料相近的热膨胀系数, 热稳定性好, 经热等静压后合金的性能进一步提高. 喷射沉积70%Si-Al合金具有良好的机械加 工性能, 可以用作功率芯片、微波电子器件、集成电路块等的封装材料.
70%Si-Al alloy as a novel electronics package material was prepared by spray deposition. HIP technique was adopted in order to density the billet. The prepared 70%Si-Al alloy has a microstructure with fine silicon particles (10-20 μm in diameter) well dispersed in the matrix. The alloy shows excellent comprehensive properties, especially a lower thermal expansion coefficient and a lower density compared with the traditional electronics packaging materials. After HIP, The comprehensive properties of the 70%Si-Al alloy can be further enhanced. The alloy can be machined with the traditional cutting tools and applied as the packaging materials for the power IC, microwave electronic parts and integrate circuit blocks.
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