管脚无铅覆层的Sn晶须问题

功能材料, 2005, 36(7): 971-974.

管脚无铅覆层的Sn晶须问题

吴懿平 ^1, , 刘一波 ^2, , 吴丰顺 ^3, , 安兵 ^4, , 张金松 ^5, , 陈明辉 ^6,

1.华中科技大学,塑性成形模拟及模具技术国家重点实验室,湖北,武汉,430074

2.华中科技大学,塑性成形模拟及模具技术国家重点实验室,湖北,武汉,430074

3.华中科技大学,塑性成形模拟及模具技术国家重点实验室,湖北,武汉,430074

4.华中科技大学,塑性成形模拟及模具技术国家重点实验室,湖北,武汉,430074

5.华中科技大学,塑性成形模拟及模具技术国家重点实验室,湖北,武汉,430074

6.华中科技大学,塑性成形模拟及模具技术国家重点实验室,湖北,武汉,430074

基金项目: 国家自然科学基金(10474024) 中港基金(60318002)

关键词：晶须 , 无铅 , 可靠性 , 电迁移 , 封装

Sn whisker issues on lead-free finish of electronic devices

Sn镀层表面在某些情况下会长出长达数百微米的晶须,在电子器件服役过程中会导致电路短路等严重的可靠性问题.目前普遍认为内部压应力是导致Sn晶须生长的主要动力之一;晶须生长所需的Sn原子主要以扩散方式或位错运动方式提供,而温度因素既影响原子扩散速度,又影响镀层的应力松弛.预镀Ni或者预先热处理以形成扩散阻挡层来抑制晶须生长的方法较为常用.温度循环是加速晶须生长的一种有效手段.

参考文献

[1]	Zeng K;Tu K N.[J].Materials Science and Engineering:55-105.
[2]	Brusse J A;Ewell G J;Siplon J P.CARTS 2002:22nd Capacitor and Resistor Technology Symposium[C].New Orleans:LA,2002:67-80.
[3]	Univ of Maryland CALCE .Tin Whisker Experiences[EB/OL].http://www.calce.umd.edu/lead-free/tin-whiskers,2002.
[4]	Compton K G;Mendizza A;Arnold S M.[J].Corrosion,1951(07):327-334.
[5]	Herring C;Galt J K.[J].Physical Review,1952:1060-1061.
[6]	Peach.[J].Journal of Applied Physics,1952(12):1401-1043.
[7]	Frank F C.[J].Philosophical Magazine,1953(07):854-860.
[8]	Eshelby.[J].Physical Review,1953:755-756.
[9]	Amelinckx S;Bontinck W;Dekeyser W.[J].Philosophical Magazine,1957(15):355-377.
[10]	Lindborg U.[J].Acta Materialia,1976:181-186.
[11]	Ellis W C;Gibbons D F;Treuting R C.Growth of Metal Whiskers From the Solid, Growth and Perfection of Crystals[M].New York:John Wiley & Sons,1958:102-120.
[12]	Glazunova V K;Kudryavtsev N T.[J].Translated from Zhurnal Prikladnoi Khimii:543-550.
[13]	Kakeshita T;Shimizu K;Kawanaka R.[J].Journal of Materials Science:2560-2566.
[14]	Fisher R M;Darken L S;Carroll K G.[J].Acta Materialia,1954:368-372.
[15]	Hasiguti R R.[J].Acta Metallurgica Sinica(English Letters):200-201.
[16]	Tu K N.[J].Acta Materialia,1973:347-354.
[17]	Tu K N.[J].PHYSICAL REVIEW B,1994(03):2030-2034.
[18]	TU K N;Zeng K.Reliability Issues of Pb-free Solder Joints in Electronic Packaging Technology[A].San Diego,2002:1194-1199.
[19]	Lee B Z;Lee D N.[J].Acta Materialia,1998(10):3701-3714.
[20]	Galyon G T.Annotated Tin Whisker Bibliography[M].Los Angesles:NEMI Pub,2003:1-22.
[21]	Pitt C H;Henning R G.[J].Journal of Applied Physiology,1964:459-460.
[22]	Diehl R.[J].Metal Finishing:37-42.
[23]	Arnold S M.[J].Plating Magazine:96-99.
[24]	Vo N;Nadaira Y;Matsura T.Pb-free Plating for Peripheral/Leadframe Packages[A].Orlando,2001:213-218.
[25]	Glazunova V K.[J].Translated from Kristallografiya:761-768.
[26]	Lee J C B;Yao Y L;Chiang F Y.Characterization Study of Lead-free SnCu Plated Packages[A].San Diego,2002:1238-1245.
[27]	Arnold S M.The Growth and Properties of Metal Whiskers[A].San Francisco,1956:26-31.
[28]	Vo N;Nadaira Y;T Matsura.Pb-free Plating for Peripheral/Leadframe Packages[A].San Francisco,2001:213-218.
[29]	Brusse J.Tin Whisker Observations on Pure Tin-Plated Ceramic Chip Capacitor[M].New York: Proc AESF SUR/FIN,2002:45-58.
[30]	Williams C .NEMI Team Recommends Three Test Conditions for Evaluating Tin Whisker Growth[EB/OL].http://www.nemi.org/newsroom/PR/2003/PR092603.html,2003.
[31]	Choi W J;Lee T Y;Tu K N.Structure and Kinetics of Sn Whisker Growth on Pb-free Solder Finish[A].SanDiego,2002
[32]	Huntington H B;Grone A R.[J].Journal of Physics and Chemistry of Solids,1961:76.

上一张下一张

计量

下载量()
访问量()

作者相关

文章评分

您的评分：
1

0%
2

0%
3

0%
4

0%
5

0%

材料期刊网

管脚无铅覆层的Sn晶须问题

Sn whisker issues on lead-free finish of electronic devices

参考文献