涂层导体用织构复合基带的界面及其扩散行为

稀有金属材料与工程, 2011, 40(12): 2221-2226.

涂层导体用织构复合基带的界面及其扩散行为

高忙忙 ^1, , 索红莉 ^2, , 赵跃 ^3, , 高培阔 ^4, , 程艳玲 ^5, , 田辉 ^6, , 马麟 ^7, , 刘敏 ^8, , 周美玲 ^9,

1.北京工业大学,北京100124

2.北京工业大学,北京100124

3.北京工业大学,北京100124

4.北京工业大学,北京100124

5.北京工业大学,北京100124

6.北京工业大学,北京100124

7.北京工业大学,北京100124

8.北京工业大学,北京100124

9.北京工业大学,北京100124

基金项目: 北京自然科学基金(2092006) 国家"863"基金(2007AA032242) 国家自然科学基金(51171002) 国家"863"重点项目基金(2009AA032401) 国家"973"计划基金(2006CB01005)

关键词：复合基带 , 立方织构 , 元素扩散 , 涂层导体

Interface and Element Diffusion Behavior of the Composite Substrate Used for Coated Conductors

复合基带是一种高强、低磁并较易形成锐利立方织构的高性能织构金属基带,能够较好地满足制备高性能涂层导体用织构基带的要求.采用放电等离子烧结方法制备了Ni5W/Ni12W/Ni5W复合基带并对其内外层界面进行了研究,发现扩散界面有利于外层合金立方织构的形成.同时,将基带在1250℃分别经60,120和180 min热处理后,基带外层合金立方织构含量均保持在98％以上.分析表明,在高温热处理阶段复合基带中界面处发生了元素互扩散行为,W元素由芯层扩散至基带表层并在晶界出形成钉扎点,抑制了晶粒的异常长大现象,使复合基带外层合金立方织构在高温热处理阶段具有较好的稳定性.

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