对SiO2/聚氨酯丙烯酸酯(PUA)-环氧丙烯酸酯(EA)复合材料及PUA-EA纯树脂体系进行热失重及热分解DSC对比分析.结果表明,SiO2/PUA-EA热分解开始温度为143.8℃,在320℃出现大量失重现象,均高于PUA-EA体系.SiO2/PUA-EA作为光栅涂层与裸纤和纯树脂涂层相比,更能准确监测复合材料固化过程,并且SiO2/PUA-EA固化后残余应力约为128 kPa,低于之前报道.SEM显示,SiO2/PUA-EA与光纤内核之间结合良好,未出现分层现象.
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