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采用粉末装管法(PIT)制备(Bi,Pb)2Sr2Ca2Cu3Oy(Bi-2223)超导带材,通过X射线衍射仪、扫描电镜研究热处理气氛对Bi-2223晶粒尺寸、结晶度及相组成的影响.研究结果表明:采用空气热处理有利于Bi-2223晶粒的长大;采用7.5%O2-Ar气氛热处理带材中存在较少的非超导相,且Bi-2223的结晶度较高;通过一种复合气氛热处理(热处理过程中使用两种气氛),带材Bi-2223晶粒尺寸较大且非超导相较少.工艺优化后最终带材的临界电流密度超过20000A/cm2(自场,77K).

参考文献

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