采用换向脉冲技术在无氰氯金酸溶液中电铸制备厚金(≥50 μm).对比了直流(DC)、单脉冲(PC)、换向脉冲(PRC)电铸工艺对金层外观、表面形貌、结构和显微硬度的影响.结果表明,电铸金的工艺不同,金的沉积模式也不同.直流和单脉冲电铸所得金粒呈松散的球状堆积,孔隙较大;换向脉冲电铸所得金粒呈紧密的层状堆积,孔隙少.直流金铸层沿(220)、(222)和(311)面择优取向,单脉冲和换向脉冲金铸层均呈(111)面的择优取向.换向脉冲金铸层的显微硬度最高,与晶粒尺寸相比,铸层的致密度对显微硬度的影响更明显.
参考文献
| [1] | 王昶;袁军平.贵金属首饰制作工艺[M].北京:化学工业出版社,2008:256-237. |
| [2] | 丁启恒,高林军.无氰镀金工艺的实践[J].印制电路信息,2011(z1):170-177. |
| [3] | HE A;LIU Q;IVEY D G .Electroplating of gold from a solution containing tri-ammonium citrate and sodium sulphite[J].JOURNAL OF MATERIALS SCIENCE:MATERIALS IN ELECTRONICS,2009,20(6):543-550. |
| [4] | KATO M;OKINAKA Y .Some recent developments in non-cyanide gold plating for electronics applications[J].Gold Bulletin,2004,37(1/2):37-44. |
| [5] | SULLIVAN A M;KOHL P A .Electrochemical study of the gold thiosulfate reduction[J].Journal of the Electrochemical Society,1997,144(5):1686-1690. |
| [6] | WANG X P;ISSAEV N;OSTERYOUNG J G .A novel gold electroplating system:Gold(1)-iodide-thiosulfate[J].Journal of the Electrochemical Society,1998,145(3):974-981. |
| [7] | LI Y G;CHRZANOWSKI W;LASIA A .Nucleation and crystal growth in gold electrodeposition from acid solution Part Ⅰ:Soft gold[J].Journal of Applied Electrochemistry,1996,26(8):843-852. |
| [8] | MANDICH N V .Pulse and pulse-reverse electroplating[J].Metal Finishing,1999,97(1):375-380. |
| [9] | KIM M J;LIM T H;PARK K J et al.Characteristics of pulse-reverse eleetrodeposited Cu thin films: I.Effects of the anodic step in the absence of an organic additive[J].Journal of the Electrochemical Society,2012,159(9):D538-D543. |
| [10] | 王朝铭,刘艳.双脉冲DMS氰化光亮镀银工艺技术的应用[J].电镀与涂饰,2005(02):42-43. |
| [11] | 常立民 .脉冲电沉积(Ni-Co)/Al2O3复合镀层及其性能研究[D].哈尔滨工业大学,2006. |
| [12] | HANSAL W E G;TURY B;HALMDIENST M et al.Pulse reverse plating of Ni-Co alloys:Deposition kinetics of Watts,sulfamate and chloride electrolytes[J].Electrochimica Acta,2006,52(3):1145-1151. |
| [13] | 许维源.周期换向脉冲镀金的研究[J].电镀与精饰,1987(02):7. |
| [14] | 解瑞,谢新根,钟明全,程凯.双脉冲电源镀金工艺技术的应用[C].2013年海峡两岸(上海)电子电镀及表面处理学术交流会论文集,2013:317-319. |
| [15] | LIU Z W;ZHENG M;HILTY R D et al.The effect of pulse reversal on morphology of cobalt hard gold[J].Electrochimica Acta,2011,56(5):2546-2551. |
| [16] | 辜敏,杨防祖,黄令,姚士冰,周绍民.高择优取向Cu电沉积层的XRD研究[J].电化学,2002(03):282-287. |
| [17] | 王恩哥.薄膜生长中的表面动力学（Ⅰ）[J].物理学进展,2003(01):1-61. |
| [18] | 李荻.电化学原理[M].北京:北京航空航天大学出版社,2008:286-298. |
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