The influence of aging treatment on the microstructure, mechanical properties and electrical conductivity of Cu-0.5 wt pct Be alloy for connector material applications was investigated. The properties of mechanical strength and electrical conductivity increase with increasing aging temperature and time. Microstructure of the aged Cu-Be alloy revealed that grain size and fraction of low angle and high angle grain boundary were not greatly changed; however, transmission electron microscopy (TEM) analysis exhibited that beryllides precipitation (CoBe and NiBe) with a size of 50 nm were distributed in grains. It was, therefore concluded that these beryllide precipitates improved the mechanical strength and also it was favor in improvement of electrical conductivity.
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