欢迎登录材料期刊网

材料期刊网

高级检索

采用过氧化合物为引发剂,以明胶和丙烯酰胺为原料合成得到明胶?丙烯酰胺接枝共聚物(PGAM),并将PGAM作为铜电解添加剂应用于铜电解精炼。结果表明:PGAM能够替代硫脲用作铜电解添加剂,且对电解液中的漂浮阳极泥具有很好的絮凝作用。使用PGAM、明胶和骨胶作为添加剂时,在电解液温度为65℃、电流密度为235 A/m2的条件下,电解168 h后,所得高纯阴极铜中As、Sb和Bi含量分别为5.1×10?7、1.24×10?6、6.9×10?7,远低于使用硫脲、明胶和骨胶作为添加剂时所得阴极铜中相应杂质含量。电解所得阳极泥中,As、Sb和Bi含量分别为5.12%、4.04%和1.01%;而硫脲、明胶和骨胶为添加剂时,阳极泥中As、Sb和Bi含量分别为3.25%、2.20%和1.95%,表明PGAM有利于电解液中As和Sb的沉降。线性扫描伏安测试表明:PGAM在Cu2+还原过程中起极化作用,提高了Cu2+还原峰电流密度;与明胶和骨胶共同使用时,其极化作用减弱,峰电流密度降低。

The gelatin-acrylamide graft copolymer (PGAM) was synthesized by acrylamide and gelatin using peroxide as initiator, and the PGAM was applied in copper electrorefining as additive for the first time. The results show that this copolymer is an appropriate substitute for thiourea in copper electrorefining, and has significant flocculation effect on the floating slimes. When the graft copolymer was used as an additive combined with gelatin and bone glue, high-pure cathode copper can be obtained after electrolysis for 168 h at current density of 235 A/m2 and 65℃. The impurities of As, Sb and Bi in the cathode copper are 5.1×10?7, 1.24×10?6 and 6.9×10?7, respectively, which are much lower than those obtained by using the traditional additives of thiourea, gelatin and bone glue. The contents of As, Sb and Bi in the anode slimes are 5.12%, 4.04% and 1.01%, respectively, while those in the anode slime obtained using the thiourea as additive are 3.25%, 2.20% and 1.95%. The linear sweep voltammetry shows that the copolymer has polarization effect on Cu2+ reduction. In the meantime, the peak current density increases. When the copolymer was used with gelatin and bone glue, the polarization effect becomes weaker and peak current density decreases.

参考文献

[1] 郑雅杰,彭映林,柯浪,陈文汨.分段电积-SO2还原工艺分离与回收铜电解液中铜砷[J].中国有色金属学报(英文版),2013(07):2166-2173.
[2] WANG Xue-wen, CHEN Qi-yuan, YIN Zhou-lan, WANG Ming-yu, TANG Fang. The role of arsenic in the homogeneous precipitation of As, Sb and Bi impurities in copper electrolyte[J]. Hydrometallurgy, 2011, 108(3):199-204.,2011.
[3] PENG Ying-lin, ZHENG Ya-jie, CHEN Wen-mi. The oxidation of arsenic from As(Ⅲ)to As(Ⅴ)during copper electrorefining[J]. Hydrometallurgy, 2012, 129/130:156-160.,2012.
[4] 彭映林,郑雅杰,周文科,陈文汨.铜电解液净化中铜砷的分离与回收[J].中国有色金属学报(英文版),2012(09):2268-2273.
[5] WANG Xue-wen, CHEN Qi-yuan, YIN Zhou-lan, ZHANG Ping-min, LONG Zi-ping, SU Zhong-fu. Removal of impurities from copper electrolyte with adsorbent containing antimony[J]. Hydrometallurgy, 2003, 69(1):39-44.,2003.
[6] BONOU L, EYRAUD M, DENOYEL R. Influence of additives on Cu electrodeposition mechanisms in acid solution:Direct current study supported by non-electrochemical measurements[J]. Electrochimica Acta, 2002, 47(26):4139-4148.,2002.
[7] MURESAN L, VARVARA S, MAURIN G. The effect of some organic additives upon copper electrowinning from sulphate electrolytes[J]. Hydrometallurgy, 2000, 54(2):161-169.,2000.
[8] FABIAN C P, RIDD M J, SHEEHAN M E. Assessment of activated polyacrylamide and guar as organic additives in copper electrodeposition[J]. Hydrometallurgy, 2007, 86(1):44-55.,2007.
[9] YU Run-lan,LIU Qing-ming,QIU Guan-zhou,FANG Zheng,TAN Jian-xi,YANG Peng.Inhibition behavior of some new mixed additives upon copper electrowinning[J].中国有色金属学会会刊(英文版),2008(05):1280-1284.
[10] MARTIN S, NEBEKER N. Polyacrylic acid additives for copper electrorefing and electrowinning. US 5733429[P]. 1998-09-10.,1998.
[11] HOPE G A, BROWN G M, SCHWEINSBERG D P, SHIMIZU K, KOBAYASHI K. Observations of inclusions of polymeric additives in copper electrodeposits by transmission electron microscopy[J]. Journal of Applied Electrochemistry, 1995, 25(9):890-894.,1995.
[12] 朱祖泽,贺家齐.现代铜冶金学[M].北京:科学出版社, 2003:527-530. ZHU Zu-ze, HE Jia-qi. Modern metallurgy of copper[M]. Beijing:Science Press, 2003:527-530.,2003.
[13] 冷延国,黄雅钦,董春玲,黄明智.明胶接枝丙烯酰胺的研究[J].高分子材料科学与工程,2002(01):93-97.
[14] 董奋强,崔英德,胡军楚,李妮妮,何春林.明胶接枝共聚丙烯酸铵-丙烯酰胺[J].材料导报,2008(05):136-139.
[15] 郑雅杰,柯浪.一种铜电解添加剂及其使用方法:CN, 201310429547.9[P]. 2013-09-23. ZHENG Ya-jie, KE Liang. A new-type additive for copper electrolytic refining:CN, 201310429547.9[P]. 2013-09-23.,2013.
[16] SUAREZ D F, OLSON F A. Nodulation of electrodeposited copper in the presence of thiourea[J]. Journal of Applied Electrochemistry, 1992, 22(11):1002-1010.,1992.
[17] TARALLO A, HEERMAN L. Influence of thiourea on the nucleation of copper on polycrystalline platinum[J]. Journal of Applied Electrochemistry, 1999, 29(5):585-591.,1999.
[18] BLECHTA V K, WANG Z Z, KRUEGER D W. Glue analysis and behavior in copper electrolyte[J]. Metallurgical Transactions B, 1993, 24(2):277-287.,1993.
[19] FABRICIUS G, SUNDHOLM G. The effect of additives on the electrodeposition of copper studied by the impedance technique[J]. Journal of Applied Electrochemistry, 1984, 14(6):797-801.,1984.
[20] 贾铮,戴长松,陈玲.电化学测量方法[M].北京:化学工业出版社, 2011:124-147. JIA Zheng, DAI Chang-song, CHEN Ling. Electrochemical measurements[M]. Beijing:Chemical Industry Press, 2011; 124-147.,2011.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%