介绍了吸杂的分类与效果以及内吸杂工艺,并综述了金属在硅中的性质,主要阐明了氧在内吸杂中的作用,简述了氮对吸杂的影响,并讨论了内吸杂的物理机理.最后探讨了今后吸杂的发展方向.
参考文献
[1] | シリコソの科学USC半导体基础技术研究会编[Z]. |
[2] | Joly J P .[J].Microelectronic Engineering,1998,40:285. |
[3] | Myers S M;Seibt M;Schroter W .[J].Journal of Applied Physics,2000,88(07):3795. |
[4] | Istratov AA.;Hieslmair H.;Weber ER.;Flink C. .Intrinsic diffusion coefficient of interstitial copper in silicon[J].Physical review letters,1998(6):1243-1246. |
[5] | Joongs Jeon.[J].Solid State Phenomena,2001(76-77):123. |
[6] | Falster R J;Fisher R G;Ferrero F .[J].Applied Physics Letters,1991,59:809. |
[7] | Kishino S et al.[J].Japanese Journal of Applied Physics,1984,23:9. |
[8] | Kitakata M.[A].Ext Abst ECS Fall Meeting,1988:694. |
[9] | [Z].MEMC Application Note,2000. |
[10] | Ryuta J;Morria E;Tanaka T .[J].Japanese Journal of Applied Physics,1992,31:293. |
[11] | Chabane sari N E et al.[J].Microelectronic Engineering,2000,51:513. |
[12] | 王启元,王俊,韩秀峰,邓惠芳,王建华,昝育德,蔡田海,郁元桓,林兰英.Ramping热退火直拉重掺锑硅衬底片的增强氧沉淀[J].半导体学报,1999(06):458. |
[13] | Ruitz H J;Pollack G P .[J].Journal of the Electrochemical Society,1978,125:128. |
[14] | Mikkelsen J C Jr.[A].Materials Research SocietyPittsburgh,1986:19. |
[15] | Hideki Takahashi et al.[J].Japanese Journal of Applied Physics Part 1,1998(37):1689. |
[16] | Laczik Z.[J].Solid State Phenomena,1991:39. |
[17] | Hieslmair H.;Weber ER.;Istratov AA. .Time-temperature profiles for optimal internal gettering of iron in silicon[J].Semiconductor Science and Technology,1998(12):1401-1406. |
[18] | Bialas F et al.[J].Microelectronic Engineering,2001,56:1587. |
[19] | Shimura F et al.[J].Applied Physics Letters,1986,48(05):224. |
[20] | 杨德仁,姚鸿年,阙端麟.微氮硅单晶中氧沉淀[J].半导体学报,1994(06):422. |
[21] | Ryuta J;Morria E;Tanaka T .[J].Japanese Journal of Applied Physics,1992,31:293. |
[22] | Yamagishi H;Fusegawa I;Fujimaki N.[J].Semiconductor Science and Technology,1992:A135. |
[23] | Kato M;Yoshida T;Ikeda Y .[J].Japanese Journal of Applied Physics,1996,35:5597. |
[24] | Hiroyuki Goto et al.[J].Japanese Journal of Applied Physics,2001,40:3944. |
[25] | Gilleo D et al.[J].Physical Review Letters,1990,64:96. |
[26] | Seibt M.;Istratov AA.;Hedemann H.;Sattler A.;Schroter W.;Griess M. .Formation and properties of copper silicide precipitates in silicon[J].Physica Status Solidi, A. Applied Research,1998(1):171-182. |
[27] | Geipel H J;Tice W K .[J].Applied Physics Letters,1977,30:325. |
[28] | Schoroter W et al.[J].Physical Review,1995,52:13726. |
[29] | Seibt M.;Istratov A.A.;Riedel F.;Sattler A.;Schroeter W.;Hedemann H. .Structural and electrical properties of metal silicide precipitates in silicon[J].Physica Status Solidi, A. Applied Research,1999(1):301-310. |
[30] | Coteau M D de.[J].Solid State Phenomena,1991:27. |
[31] | Hackel B et al.[J].Journal of the Electrochemical Society,1992,139(11):3250. |
[32] | Myers S M et al.[J].Nuclear Instruments and Methods in Physics Research B:Beam Interaction with Materials and Atoms,1997,291:127. |
[33] | Headley T J et al.In Microscopy and Microanalysis' 97[Z].Microscopy Society of America Chicago IL,1997. |
[34] | Myers S M.[A].Electrochemical SocietyPenningtonNJ,1998:1150. |
[35] | Aselage T L .[J].Journal of Materials Research,1988,13:1786. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%