随着无线通讯技术的快速发展,高性能金属-绝缘体-金属(MIM)电容器已引起人们的极大关注,成为下一代射频集成电路的必然选择.本文从MIM电容的技术背景、制备方法、绝缘介质的设计以及电极材料几个方面,对MIM电容器件的研究进展进行了较全面的综述,可望为开发下一代射频集成电路用高性能MIM电容提供技术指导.
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