利用非平衡磁控溅射技术在镜面抛光的SCM415渗碳淬火钢基片上沉积了无掺杂类金刚石(DIE)薄膜和不同含量Ti掺杂类金刚石(Ti-DIE)薄膜.利用AFM、SEM、TEM对薄膜的微观结构与形貌进行了观察,利用纳米硬度计、摩擦磨损试验仪及纳米划痕仪测试了薄膜的显微硬度、摩擦系数及薄基结合强度.结果表明:随着Ti的掺杂,薄膜硬度先迅速降低,然后保持不变,在Ti含量为25at%时薄膜硬度出现回升,膜基结合强度随Ti的掺杂呈单调增强趋势.与无掺杂类金刚石薄膜相比,掺杂Ti后薄膜表面微观凸凹增多,摩擦系数增大.对于Ti-DIE薄膜来说,随着Ti掺杂量的增加,摩擦系数出现减小的趋势.其原因在于Ti掺杂量的增加使Ti-DLC薄膜变得更加致密,同时Ti的掺杂还有利于弥补基体表面的凸凹缺陷,使薄膜变得更平滑.
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