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氮化铝因具有优良的热传导性能、高的电阻率以及与硅相匹配的热膨胀系数而备受人们关注,是优良的电路基板和电子封装材料.尽管氮化铝具有很多优点,但由于合成温度高、过程控制难、制造成本高而阻碍了它的广泛应用.目前,氮化铝的合成方法主要有铝粉直接氮化法、碳热还原法、化学气相沉积法、自蔓延燃烧合成方法和微波合成法等.概述了氮化铝粉体的几种合成方法,以及其反应机理、制造工艺、各工艺优缺点和各种方法的国内外最新研究动态,指出微波合成法具有较好的应用前景.

参考文献

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