为了了解氮化银铬和氮化钨铬纳米复合薄膜涂层应用于微型钻头加工的潜能,采多靶材非平衡磁控溅射方式制备薄膜,分别将钨(W)和银(Ag)掺杂于氮化铬(CrN)中,形成氮化钨铬(Cr-W-N)和氮化银铬(Cr-Ag-N)纳米复合薄膜,研究其基本特性及涂层于微型钻头表面加工电路板性能.结果表明,虽掺杂Ag导致硬度降低,仍可改善微型钻头加工性能;掺杂W形成W_2N化合物混杂于CrN中,因而整体涂层硬度增加,同时大幅提升微型钻头加工性能.经由本研究,确认氮化银铬和氮化钨铬纳米复合薄膜具备改善微型钻头加工电路板的能力.
To improve the machining performance of micro-drills, Cr -Ag -N and Cr -W -N nano-composite thin films were prepared by the multi-target unbalanced magnetron sputtering method. Then these films were studied for their fundamental properties and applied on micro-drills for high-speed machining of circuit boards. Results show that the performance of micro-drills can be improved although the hardness is decreased caused by Ag addition. Addition of W to CrN results in the formation of W_2N compound dispersed in the CrN films,thus the overall hardness of films is increased and the performance of micro-drills is enhanced to a large de-gree. This study confirms that the Cr -W -N and Cr -Ag -N nano-composite thin films can improve the ma-chining performance of micro drills for machining circuit boards.
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