光敏苯并环丁烯(BCB)以其优良的电特性、极低的吸水率以及能够大大简化器件制造工艺等优点成为微电子领域特别是用于多芯片组件(MCM)最理想的绝缘介质材料.介绍了目前光敏BCB的研究现状及应用情况,分析了两种常用的光敏BCB的结构和合成方法,并提出了一种新型光敏BCB的设计思路.
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