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采用等温和非等温差示扫描量热(DSC)对Huntsrnan1564/3486低黏度环氧树脂体系的固化反应进行了研究,建立了修正的Oliviei固化度唯象模型,用于描述恒温条件下固化度温度时间关系.模型计算值与实验值符合良好.监测了基于实际工程应用背景85mm厚复合材料单面模具加热固化过程中制件厚度方向的温度情况,针对该过程提出了基于修正Olivier模型的适用于变温条件的时间离散分步计算法,并计算了固化过程厚度方向的固化度分布.

The curing reaction of the low viscosity Huntsman 1564/3486 epoxy resin system was studied by differential scanning calorimetry (DSC) technique under isothermal and dynamic curing conditions. The rnodified Olivier's phenomenological model was established to predict the relationship between the degree of cure and the couple of time and temperature. The model was verified by the experimental date. A GFRP laminates with thickness of 85 mm used in the engineering were cured by one-side rigid mould heating, and the temperature curves at different thickness position during curing were measured. The method of accumulation by time dispersing steps was proposed, and it's used to calculate the degree of cure curves based on the temperature curves at different thickness position.

参考文献

[1] Je Hoon;Dai Gil Lee .Cure Cycle for Thick Glass/Epoxy Composite Laminates[J].Journal of Composite Materials,2002(1):19-45.
[2] Z. L. Yang;S. Lee .OPTIMIZED CURING OF THICK SECTION COMPOSITE LAMINATES[J].Materials and Manufacturing Processes,2001(4):541-560.
[3] Jeninger W.;Schawe J.E.K. .Calorimetric studies of isothermal curing of phase separating epoxy networks[J].Polymer: The International Journal for the Science and Technology of Polymers,2000(4):1577-1588.
[4] Su CC.;Woo EM. .CURE KINETICS AND MORPHOLOGY OF AMINE-CURED TETRAGLYCIDYL-4,4'-DIAMINODIPHENYLMETHANE EPOXY BLENDS WITH POLY(ETHER IMIDE)[J].Polymer: The International Journal for the Science and Technology of Polymers,1995(15):2883-2894.
[5] Bejoy Francis;Geert Vanden Poel;Fabrice Posada;Gabriel Groeninckx;V.Lakshmana Rao;R.Ramaswamy;R.Ramaswamy .Cure kinetics and morphology of blends of epoxy resin with poly(ether ether ketone) containing pendant tertiary butyl groups[J].Polymer: The International Journal for the Science and Technology of Polymers,2003(13):3687-3699.
[6] Karkanas PI.;Partridge IK. .Cure modeling and monitoring of epoxy/amine resin systems. I. Cure kinetics modeling[J].Journal of Applied Polymer Science,2000(7):1419-1431.
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