利用扫描电镜(SEM)、能谱(EDS)和X射线衍射(XRD)分析W和Ti熔渗烧结合金的微观组织形貌和相结构;利用原子相图(TFDC)讨论W-Ti固溶体的形成机制、计算该固溶体的电子密度.结果表明,W骨架在1750℃熔渗Ti的过程中,Ti和W可发生互溶,形成置换固溶体TixWi1-x.这种固溶体的HV0.1为3350～5280 MPa,电子密度为2.4851×1029个/m3,计算其点阵常数为0.3140 nm.
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