研究了DMDMH(1,3-二羟甲基-5,5-二甲基乙内酰脲)为配位剂的无氰镀银工艺.在讨论镀液组成及工艺条件对镀层外观质量影响的基础上,确定了最佳电镀工艺.阴极电流效率,分散能力、覆盖能力、结合强度等测试表明,DMDMH无氰镀银工艺基本达到了氰化物镀银工艺的性能,有望成为氰化物镀银的替代工艺.
参考文献
| [1] | de Oliveira GM;Barbosa LL;Broggi RL;Carlos IA .Voltammetric study of the influence of EDTA on the silver electrodeposition and morphological and structural characterization of silver films[J].Journal of Electroanalytical Chemistry: An International Journal Devoted to All Aspects of Electrode Kinetics, Interfacial Structure, Properties of Electrolytes, Colloid and Biological Electrochemistry,2005(1):151-158. |
| [2] | Sobha Jayakrishnan;S.R. Natarajan;K.I. Vasu .Alkaline Noncyanide Bath for Electrodeposition of Silver[J].Metal finishing,1996(5):12,14-15-0. |
| [3] | S. Masaki;H. Inoue;H. Honma .Mirror-bright silver plating from a cyanide-free bath[J].Metal finishing,1998(1A):16-20. |
| [4] | MIRANDA-HERN áNDEZ M;GONZáLEZ I .Study of the silver electrodeposition with non-stationary techniques in an ethylamine aqueous medium[J].Electrochimica Acta,1997,42(15):2295-2303. |
| [5] | B. Reents;W. Plieth;V. A. Macagno;G. I. Lacconi .Influence of thiourea on silver deposition: Spectroscopic investigation[J].Journal of Electroanalytical Chemistry: An International Journal Devoted to All Aspects of Electrode Kinetics, Interfacial Structure, Properties of Electrolytes, Colloid and Biological Electrochemistry,1998(1/2):121-127. |
| [6] | Simons W.;Hubin A.;Gonnissen D. .STUDY OF THE INITIAL STAGES OF SILVER ELECTROCRYSTALLISATION FROM SILVER THIOSULPHATE COMPLEXES .1. MODELLING OF THE SILVER NUCLEI FORMATION DURING THE INDUCTION PERIOD[J].Journal of Electroanalytical Chemistry: An International Journal Devoted to All Aspects of Electrode Kinetics, Interfacial Structure, Properties of Electrolytes, Colloid and Biological Electrochemistry,1997(1/2):141-151. |
| [7] | VANDEPUTTE S;HUBIN A;VEREECKEN J .Influence of the sodium nitrate content on the rate of the electrodeposition of silver from thio-sulphate solutions[J].Electrochimica Acta,1997,42(23/24):3429-3441. |
| [8] | GONNISSEN D;VANDEPUTTE S;HUBIN A et al.Investigation of the mechanism of silver deposition from thiosulphate solutions by means of ac impedance measurements and surface-enhanced Raman spectroscopy[J].Electrochimica Acta,1996,41(7/8):1051-1056. |
| [9] | 卢俊峰,安茂忠,郑环宇,王克迪.5,5-二甲基乙内酰脲无氰镀银工艺的研究[J].电镀与环保,2007(01):9-11. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%