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采用差热分析、显微硬度测试、X射线衍射分析对牙科低金含量银钯合金的时效强化机制进行了初步探讨.结果表明:400℃等温时效20 min和459℃等温时效10 min样本的显微硬度较ST组样本分别提高了50%和128.5%,600℃等温时效5 min组样本显微硬度较ST组样本降低了8%;合金在459℃和600℃有明显CuPd相析出,但是CuPd相与硬度的提高没有联系,合金硬度提高与Cu原子从基质相析出有关.

参考文献

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