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采用无压浸渗工艺制备出低成本金刚石/铝复合材料,并对复合材料的显微组织、界面及导热性能进行了研究.实验结果表明,采用无压浸渗工艺制备的金刚石/铝复合材料,组织致密,颗粒分布均匀.金刚石/铝复合材料的热导率随着金刚石含量的增加而增加,热导率最高可达298 W/(m· K).

参考文献

[1] 童震松,沈卓身.金属封装材料的现状及发展[J].电子与封装,2005(03):6-15.
[2] 黄强,顾明元.电子封装用金属基复合材料的研究现状[J].电子与封装,2003(02):22-25.
[3] Field J E.The properties of natural and synthetic diamond[M].London,UK:Academic Press,1992
[4] P.W. Ruch;O. Beffort;S. Kleiner .Selective interfacial bonding in Al(Si)-diamond composites and its effect on thermal conductivity[J].Composites science and technology,2006(15):2677-2685.
[5] O. Beffort;F.A. Khaltd;L. Weber .Interface formation in infiltrated Al(Si)/diamond composites[J].Diamond and Related Materials,2006(9):1250-1260.
[6] Johnson W B;Sonuparlak B .Diamond/Al metal-matrix composites formed by the pressureless metal infiltration process[J].Journal of Materials Research,1993,8(05):1169.
[7] Katsuhito Yoshida;Hideaki Morigami .Thermal properties of diamond/copper composite material[J].Microelectronics and reliability,2004(2):303-308.
[8] K. Hanada;K. Matsuzaki;T. Sano .Thermal properties of diamond particle-dispersed Cu composites[J].Journal of Materials Processing Technology,2004(0):514-518.
[9] E.A. Ekimov;N.V. Suetin;A.F. Popovich .Thermal conductivity of diamond composites sintered under high pressures[J].Diamond and Related Materials,2008(4/5):838-843.
[10] N. Chen;X.-F. Pan;M.-Y. Gu .Microstructure and physical properties of Al/ diamond composite fabricated by pressureless infiltration[J].Materials Science and Technology: MST: A publication of the Institute of Metals,2009(3):400-402.
[11] CHU Ke,JIA Chengchang,LIANG Xuebing,CHEN Hui.Effect of powder mixing process on the microstructure and thermal conductivity of Al/diamond composites fabricated by spark plasma sintering[J].稀有金属(英文版),2010(01):86-91.
[12] 刘永正,崔岩.超高导热金刚石/铝复合材料研究[C].第七届中国功能材料及其应用学术会议论文集,2010:439-441.
[13] Progelhof R C;Throne J L;Ruetsch R R .Methodes for predicting the thermal conductivity of composite systems[J].Polymer Engineering and Science,1976,16(09):615.
[14] Hasselman D P H;Johnson L F .Effective thermal conductivity of composites with interfacial thermal barrier resistance[J].Journal of Composite Materials,1987,21(06):508.
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