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采用湿法腐蚀工艺,对PVT法生长的碳化硅单晶缺陷进行了研究.利用熔融态KOH和K2CO8作为腐蚀剂,通过分别改变腐蚀剂配比、腐蚀时间、腐蚀温度的方法,获得了良好的湿法腐蚀工艺参数.用CCD光学显微镜和SEM观察腐蚀以后的晶体表面形貌.结果表明,最佳腐蚀工艺参数为K2CO3:KOH=5 g:200 g,440 ℃/30 min.腐蚀以后(0001)Si表面可以清晰地观察到微管、基面位错、螺位错和刃位错.实验还发现晶片表面抛光质量会影响腐蚀后SiC表面的形貌.

参考文献

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[2] Siche D;Klimm D;Holzel T;Wohlfart A .Reproducible defect etching of SiC single crystals[J].Journal of Crystal Growth,2004(1/2):1-6.
[3] Ohtani N;Katsuno M;Tsuge H;Fujimoto T;Nakabayashi M;Yashiro H;Sawamura M;Aigo T;Hoshino T .Propagation behavior of threading dislocations during physical vapor transport growth of silicon carbide (SiC) single crystals[J].Journal of Crystal Growth,2006(1):55-60.
[4] Emorhokpor E;Kerr T;Zwieback I.Characterization and Mapping of Crystal Defects in Silicon Carbide[A].USA,2004:81.
[5] S.A. Sakwe;R. Mueller;P.J. Wellmann .Optimization of KOH etching parameters for quantitative defect recognition in n- and p-type doped SiC[J].Journal of Crystal Growth,2006(2):520-526.
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