在1.3Pa的真空环境下,用扩散焊接法进行了Cu-x%Bi合金（x=0,0.5,1.0,2.0）与ZrO2陶瓷的连接,并采用扫描电镜、电子探针及剪切试验机等研究了铜铋合金与ZrO2陶瓷扩散焊接头的组织及剪切强度。结果表明：在焊接压力作用下挤入接合界面的铋,在焊接后部分残留在界面上,对焊接热应力有缓释作用,可提高接头的剪切强度;当接头的使用温度高于373K后,由于界面上铋的软化,接头的剪切强度急剧下降,难以在高温环境中使用。
Diffusion bonding between Cu-x%Bi（x=0,0.5,1.0,2.0） alloy and ZrO2 ceramic was carried out under the vacuum condition of 1.3 Pa.The microstructure and shear strength of joint between Cu-Bi alloy and ZrO2 was studied by scanning electron microscopy,electron probe（EPMA） and shear tester.The results show that the Bi elements were squeezed into bonding interface by welding pressure and partial Bi remained on the interface after welding could relax the thermal stress and increase the shear strength of the joint.However,the shear strength of the joint decreased sharply because Bi element on the interface would softened after the using temperature was more than 373 K,so it was difficult that the joint was used in high-temperature environment.
参考文献
| [1] | Houhong Pan;Isao Itoh;Masaaki Matsubara .Mechanical Properties of Diffusion Bonding Joint of SiC and Al-Sn Alloys at Elevated Temperatures[J].Materials transactions,2001(12):2543-2547. |
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