介绍了可代替铜及铜合金基体镀金用的保护材料──溶剂型SP-2085C和水溶性LP-1087C电接触润滑保护剂，说明了其制备方法与涂覆工艺。通过抗腐蚀性试验(湿热、SO2气氛和盐雾)及电气性能试验(抗电强度、绝缘电阻、接触电阻、微波性能和可焊性)，并与镀金板以及未做处理的基材对比，证明这2种材料不仅能替代镀金，而且涂覆后的铜表面耐蚀性优于镀金表面，电气性能和微波传输性未受影响，对环境更友好，且成本更低。
The solvent type SP-2085C and water-soluble LP-1087C electrical contact lubrication protective agents used for replacing gold plating on copper and copper alloy substrates were introduced. Their preparation and coating processes were described. Through corrosion resistance tests (damp-heat, sulfur dioxide atmosphere, and salt spray) and electrical property tests (dielectric strength, insulation resistance, contact resistance, microwave transmission, and weldability), it was showed that, compared with the substrates coated with gold and untreated ones, the two materials not only can substitute gold plating, but also provide better corrosion resistance for copper and copper alloy surfaces than gold plating, not affecting the electrical properties and microwave transmission of products. Besides, the two materials are more environmentally friendly with lower prices.
参考文献
| [1] | MENDOZA A R;CORVO F .Outdoor and indoor atmospheric corrosion of carbon steel[J].Corrosion Science,1999,41(01):75-86. |
| [2] | 郑兆翁.同轴式TEM模通用无源器件[M].北京:人民邮电出版社,1983:358. |
| [3] | 张宝根 .正确地选择电接触材料[J].机电元件,1992,12(04):6-12,53. |
| [4] | 章继高;李家樾.电接触理论与设计技术[J].电子机械技术,1984(08):105. |
| [5] | 赵晓利,张宝根.金镀层表面腐蚀机理及抗腐蚀性保护[J].电子工艺技术,2005(06):362-364,369. |
| [6] | 廖明福;吴鸿恩.润滑技术的应用[M].西安:陕西科学技术出版社,1985:91. |
- 下载量()
- 访问量()
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%