以γ-缩水甘油醚氧丙基三甲氧基硅烷(KH560)和γ-甲基丙烯酰氧基丙基三甲氧基硅烷(KH570)为改性剂,正硅酸乙酯(TEOS)为前驱体,盐酸(HCl)为催化剂,利用溶胶-凝胶法制备SiO2/KH560/KH570增透膜.研究了反应物配比对溶胶性能的影响,测试了薄膜的光学以及力学性能.结果表明,随着酸用量的增加,溶胶粘度增加,凝胶时间缩短;SiO2/KH560/KH570薄膜在波段350～800nm间平均透过率增加3％～4％,具有良好的增透效果,而且抗划伤能力强.
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