研究室温下Pt电极上Dy3+离子在1-乙基-3-甲基-咪唑四氟硼酸盐(EMIMBF4)离子液体中的电化学行为.循环伏安法结合计时电流法和计时电位法研究结果表明,Dy3+离子的电化学还原是不可逆过程,还原为一步完成,即Dy3++3e→Dy.计时电流法结合恒电位电解研究表明,Dy3+离子的还原过程受扩散控制.测得浓度0.01 mol/L的Dy3+离子在0.1mol/L LiCl-EMIMBF4离子液体中的传递系数、扩散系数分别为0.176和(4.87-5.04)×10-10 cm2/s.SEM和XRD分析表明,金属镝颗粒直径为几百纳米.
参考文献
| [1] | 林河成.金属镝材料的生产及应用[J].稀土,2001(03):75-78. |
| [2] | 张世荣.金属镝的制备、提纯及应用[J].稀有金属与硬质合金,2000(03):53-59. |
| [3] | Matsuura, H;Numata, H;Fujita, R;Akatsuka, H .Reprocessing of spent hydrogen absorbing alloys by using electrochemical techniques in molten salts[J].The journal of physics and chemistry of solids,2005(2/4):439-442. |
| [4] | Anthony J L;Bennecke J F;Holbrey J D;Wasserscheid P,Welton T.Ionic Liquids in Synthesis[M].New York:Wiley-VCH Verlag GmbH & Co,2002:144. |
| [5] | Kumbhar P P;Lokhande C D .[J].Metal Finishing,1994,92:70. |
| [6] | Castrillejo Y;Bermejo M R;Barrado A I et al.[J].Electrochimica Acta,2005,50:2047. |
| [7] | Lodermeyer J;Multerer M;Zistler M et al.[J].Journal of the Electrochemical Society,2006,153:C242. |
| [8] | Jiang T;Brym MJC;Dube G;Lasia A;Brisard GM .Electrodeposition of aluminium from ionic liquids: Part I - electrodeposition and surface morphology of aluminium from aluminium chloride (AlCl3)-l-ethyl-3-methylimidazolium chloride ([EMIm]Cl) ionic liquids[J].Surface & Coatings Technology,2006(1/2):1-9. |
| [9] | Jiang T;Brym MJC;Dube G;Lasia A;Brisard GM .Electrodeposition of aluminium from ionic liquids: Part II - studies on the electrodeposition of aluminum from aluminum chloride (AICl(3)) - trimethylphenylammonium chloride (TMPAC) ionic liquids[J].Surface & Coatings Technology,2006(1/2):10-18. |
| [10] | Liu QX;El Abedin SZ;Endres F .Electroplating of mild steel by aluminium in a first generation ionic liquid: A green alternative to commercial Al-plating in organic solvents[J].Surface & Coatings Technology,2006(3/4):1352-1356. |
| [11] | Zein EI;Abedin S;Moustafa E M et al.[J].Electrochemistry Communications,2005,7:1111. |
| [12] | Galasiu I;Galasiu R;Thonstad J;Aurbach D.Nonaqueous Electrochemistry[M].Berlin:Springer Science,1999:461. |
| [13] | Riechel T L;Wilkes J S .[J].Journal of the Electrochemical Society,1992,139:977. |
| [14] | Li G R;Tong Y X;Liu G K .[J].Materials Letters,2004,54:3839. |
| [15] | Tan S Z;Yuan D S;Liu Y L .[J].Materials Letters,2006,60:2056. |
| [16] | Yuan D S;Liu Y L;Liu G K .[J].Journal of the Electrochemical Society,2004,151:C749. |
| [17] | Yuan D S;Tong Y X;Liu G.K .[J].Journal of Electroanalytical Chemistry,2002,536:123. |
| [18] | Legeai S;Diliberto S;Stein N;Boulanger C;Estager J;Papaiconomou N;Draye M .Room-temperature ionic liquid for lanthanum electrodeposition[J].Electrochemistry communications,2008(11):1661-1664. |
| [19] | Zein EI;Abedin S;Welz-Biermann U et al.[J].Electrochemistry Communications,2005,7:941. |
| [20] | Zein E I;Abedin S;Boressinko N et al.[J].Electrochemistry Communications,2004,6:510. |
| [21] | Yamagata M;Katayama Y;Miura Y .[J].Journal of the Electrochemical Society,2006,153:E5. |
| [22] | Bard A J;Faulkner L R.Electrochemical Methods[M].New York:John Wiley and Sons,Inc,2001:236. |
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