铜丝表面镀钯是提高抗氧化性进而改善键合性能的有效手段.镀钯键合铜丝具有优异的综合性能,是半导体封装材料连接导线的新型材料.综述了镀钯键合铜丝国内外的发展现状、研究背景、镀钯工艺及金丝、铜丝和镀钯铜丝的比较.
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