应用化学镀铜方法对TiB2颗粒进行表面镀铜,采用微波烧结技术制备了含TiB2体积分数不同的TiB2/Cu复合材料,测试了试样在50～300℃区间的膨胀系数,探讨了TiB2含量及其表面改性对TiB2/Cu复合材料热膨胀系数的影响.结果表明:随着TiB2含量的增加,复合材料的膨胀系数降低;TiB2颗粒表面镀铜后,在TiB2相同含量条件下,TiB2/Cu复合材料的膨胀系数进一步降低;理论模型计算结果表明,TiB2未镀铜的TiB2/Cu复合材料的膨胀系数与ROM模型计算值相符合,而TiB2镀铜的TiB2/Cu复合材料的膨胀系数与Kerner模型计算值相符合,反映了TiB2颗粒镀铜后能很好地改善颗粒与基体的结合.
The TiB2/Cu composites contained different volume fractions of TiB2 were fabricated by microwave sintering.The coefficient of thermal expansion (CET) of all samples were measured in the range of 50～300 ℃ with a dilatometer.And the effects of TiB2 content and TiB2 surface modification treatment of electroless copper plating on the CET of TiB2/Cu composites were also discussed.The results show that CET of TiB2/Cu composites decreases with increasing of TiB2 content.After the TiB2 surface is modified with chemical plating copper,the CET of the TiB2/Cu composites further decreases with the same TiB2 content.The results of theoretical calculation indicate that the CET of the TiB2/Cu composites with TiB2 of no plating copper is consistent with the calculated value of ROM model,while the CET of the TiB2/Cu composites with TiB2 of plating copper is consistent with the calculated value of Kerner model,which suggests that the interface of the TiB2 particles and the matrix is greatly improved after the TiB2 particles are modified with plating copper.
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