采用K2TiF-6-KBF4-KF-KCl融盐体系在石墨基体上电沉积制备TiB2镀层.考察了预电解条件和电活性组分的含量对镀层性能的影响.实验结果表明:预电解对镀层的组成影响较大;在K2TiF6与KBF4的摩尔比为1∶2.5,并且其总含量较高的条件下,镀层与基体结合力好,重复性好,但是晶粒较大,含有少量杂质;在K2TiF6与KBF4的摩尔比为1∶7.5,并且其总含量较低的条件下,得到的镀层晶粒细小,有金属光泽,TiB2的纯度很高,但是重复性较差.需要进一步进行电化学实验,明确电沉积的机理.
参考文献
| [1] | Billehaug K;Oye H A .[J].Aluminium,1980,56:642. |
| [2] | Matas ovsky K;Grjotheim K;Makyta M .[J].METALL,1988,44:1196. |
| [3] | 邱竹贤;王兆文;高炳亮 et al.[J].稀有金属材料与工程,2001,30(ZK):503-506. |
| [4] | 赵群;邱竹贤 .Rare Metal Materi-als and Engineering(称有金属材料与工程)[J].称有金属材料与工程,2002,31(01):528-531. |
| [5] | 刘业翔 .Light Metal(轻金属)[J].轻金属,2001,5:26. |
| [6] | Wieslaw A.[J].Journal of the Electrochemical Society,1986(09):1777-1781. |
| [7] | Gesing A J;Jwheeler D.[J].Light Metals,1987:327-334. |
| [8] | Makyta M.;Haarberg GM.;Thonstad J.;Danek V. .ELECTRODEPOSITION OF TITANIUM DIBORIDE FROM FUSED SALTS[J].Journal of Applied Electrochemistry,1996(3):319-324. |
| [9] | Gerhard Ett;Elisabete J .[J].Pessine Electrochimica Acta,1999,44:2859-2870. |
| [10] | Ett G;Pessine E J.[J].Plating and Surface Finishing,2000(06):118-120. |
| [11] | 段淑贞;石青荣;王新东.[J].北京科技大学学报,1996(01):46-49. |
| [12] | Schlain D;Mc Cawley F X;Wyche Ch .[J].Journal of the Electrochemical Society,1969,116:1227. |
| [13] | Bing Li,Fei ZHOU,Zhuxian QIU.Preparation of TiB2 Coated Cathode of Al Electrolysis[J].材料科学技术学报(英文版),2001(z1):S171-S173. |
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