以三甲基铝(TMA)和水为反应源,采用原子层沉积(ALD)技术在n型单晶硅表面沉积15 nm、30 nm和100 nm的Al2O3薄膜,并对样品进行快速退火(RTA)处理.采用少子寿命测试仪测试样品的有效少子寿命,获得了表面复合速率(SRV),通过X射线光电子能谱(XPS)分析了薄膜的化学成分,在此基础上研究了薄膜厚度及退火条件对钝化效果的影响,并分析了钝化机理.结果表明:ALD技术制备的Al2O3薄膜经退火后可使n型单晶硅SRV值降低到7 cm/s,表面钝化效果显著.
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