本文从集成电路和半导体材料(多晶硅,SiGe-HBT材料)、光电子材料(高亮度LED用GaN基异质外延材料,液晶材料)、新型电子元器件材料(电子封装材料,绿色电池材料,覆铜板材料)3方面介绍了基于低碳经济的电子信息材料的研究现状和发展前景.根据低碳经济的发展需求,展望了电子信息材料的发展趋势:向着大尺寸、智能化、多功能化、高集成化、节能环保型方向发展.
参考文献
| [1] | ZhongXiang Zhang .China in the transition to a low-carbon economy[J].Energy policy,2010(11):6638-6653. |
| [2] | 蔡晓睿.2008年电子材料技术发展[J].信息与电子工程,2008(06):1-5. |
| [3] | 苏维.多晶硅生产的节能减排措施[J].有色金属加工,2008(02):57-59. |
| [4] | 杨涛.改良西门子法生产多晶硅工艺设计探讨[J].贵州化工,2009(03):7-11. |
| [5] | Woitok JF.;Visser CCG.;Scholtes TLM. .Structural characterization of highly boron doped SiGe/Si heterostructures[J].Materials Science & Engineering, B. Solid-State Materials for Advanced Technology,2002(1/3):216-220. |
| [6] | Naichia Yen;Jen-Ping Chung .High-brightness LEDs-Energy efficient lighting sources and their potential in indoor plant cultivation[J].Renewable & sustainable energy reviews,2009(8):2079-2087. |
| [7] | Kesti T;Golemme A .Photorefractive nematic liquid crystal with gain of constant sign under alternating voltage[J].Applied Physics Letters,2006,88(011917):1-3. |
| [8] | Liu, W.;Wang, Z.;Xiong, L.;Zhao, L. .Phosphorus-containing liquid cycloaliphatic epoxy resins for reworkable environment-friendly electronic packaging materials[J].Polymer: The International Journal for the Science and Technology of Polymers,2010(21):4776-4783. |
| [9] | Abtew M;Selvaduray G .Lead-free solders in microelectronics[J].Materials Science and Engineering,2000,27(01):95-141. |
| [10] | 吴锋.绿色二次电池材料的研究进展[J].中国材料进展,2009(07):41-49. |
| [11] | Enbo Shangguan;Zhaorong Chang;Hongwei Tang;Xiao-Zi Yuan;Haijiang Wang .Synthesis and characterization of high-density non-spherical Ni(OH)_2 cathode material for Ni-MH batteries[J].International journal of hydrogen energy,2010(18):9716-9724. |
| [12] | N. Recham;M. Armand;J.-M. Tarascon .Novel low temperature approaches for the eco-efficient synthesis of electrode materials for secondary Li-ion batteries[J].Comptes Rendus Chimie,2010(1/2):106-116. |
| [13] | 侯明,衣宝廉.燃料电池技术发展现状[J].电源技术,2008(10):649-654. |
| [14] | 师剑英,史丽梅.环保型覆铜板的开发[J].绝缘材料,2001(01):38-40. |
| [15] | 李来丙,李立波.新一代绿色无卤化覆铜板的研制开发[J].工程塑料应用,2004(05):42-44. |
| [16] | 谢广超,杜新宇,韩江龙.环氧模塑料在半导体封装中的应用[J].中国集成电路,2008(03):64-69. |
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