复合电镀是制造复合材料的一种新方法,在过去的30多年里得到了极大的发展,关于电镀工艺和镀层性能的研究也较为深入,但对镀层形成机理的研究却远远滞后于工艺和性能的研究.本文在综合大量研究工作的基础上,从复合电镀机理研究历史和现状的角度,详细介绍了国内外关于复合电镀机理研究的概况,评述了机理的主要内容和适用范围,给出了相关的数学模型,探讨了机理研究的最新进展,同时展望了今后复合电镀机理研究的方向及其发展趋势.
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