欢迎登录材料期刊网

材料期刊网

高级检索

综述了Sn-Zn系无铅焊料的特性,以及工艺性能和服役性能等方面的研究进展,反映了当前研究中存在的问题及今后需做的努力.从熔点、毒性、资源和价格来看,Sn-Zn系无铅焊料是最佳选择.目前针对其润湿性、耐蚀性及疲劳性差等问题的研究已取得了很大进步.Sn-Zn系列仍是现在正在研制的各种无铅焊料中最有前途的一种.

参考文献

[1] 黄惠珍,魏秀琴,周浪.无铅焊料及其可靠性的研究进展[J].电子元件与材料,2003(04):39-42.
[2] 鲜飞.无铅焊锡的研究[J].新技术新工艺,2001(06):32.
[3] Prasad R P .Lead-free solder[J].SMT,2000,14:26.
[4] 汤佩钊,孙加林,陈敬超,孙勇,胡大禄.节锡焊料的研究[J].昆明理工大学学报(理工版),2000(06):68-72.
[5] Cormack M M;Jin S;Kammlott G W et al.New Pb-free solder alloy with superior mechanical properties[J].Applied Physics Letters,1995,63:15.
[6] 庄鸿寿.无铅软钎料的新进展[J].电子工艺技术,2001(05):192-196.
[7] 张虹;白书欣 .无铅钎料的研究与开发[J].材料导报,1998,12(02):21.
[8] 石霖.合金热力学[M].北京:机械工业出版社,1992:274.
[9] 王磊.无铅焊锡开发研究的动向[J].材料与冶金学报,2002(01):9-14,44.
[10] 王国勇,刘晓波.Sn-Zn系电子无铅软钎料湿润性能的研究[J].四川大学学报(工程科学版),2001(05):66-68.
[11] 马鑫;方洪渊;董秀丽 等.Sn-Zn-In软钎料合金初步研究[J].电子工艺技术,1996,17(05):28.
[12] Cormack M M;Jin S;Chen H S .New lead-free Sn-Zn-In solder alloys[J].Journal of Electronic Materials,1994,23(07):687.
[13] Kitajima M;Homma H;Takesue M et al.Solder alloy and soldered bond[P].US 6361626B1,2002.
[14] Li Jianxing;Michael P .Lead-free alloys with improved wetting properties[P].WO 0209936A1,2002.
[15] Bamch K;Alberto K .Lead-free alloy[P].WO 03004713A2,2003.
[16] Murata T;Noguchi H;Kishida S et al.Lead-free solder alloys[P].US 6241942B1,2001.
[17] Masaaki Y;Haruo A .Tin-zinc lead-free solder[P].US 2004156741,2004.
[18] Masaaki Y;Kazuhiro S .Tin-zinc based lead free solder alloy powder and production method[P].JP 2003019591,2003.
[19] Takashi N;Toshihiko T .Lead-free zinc-containing solder paste[P].US 6440228,2002.
[20] 张国栋,俞伟元,路文江,陈学定,何成旦,张建晓.快凝锡基软钎料的浸润性研究[J].甘肃工业大学学报,1999(04):7-10.
[21] 朱颖,曲平,康慧.机械振动对钎料润湿性的影响[J].材料工程,1999(06):30-32.
[22] Chan Y.C.;Tu P.L. .Effect of intermetallic compounds on the shear fatigue of Cu/63Sn-37Pb solder joints[J].IEEE transactions on components, packaging, and manufacturing technology.Part B.Advanced packaging,1997(4):463-469.
[23] Masazumi Amagai.Mechanical relialcility in electronic pochaging[M].Microelectron Reliale,2002:607.
[24] [OL].http://www.preceed.com/pa-simple-site/pa-physical.htm Preceed America Lead Free Solder
[25] Lee Seong et al.Thermal fatigue life prediction of gull-wing solder joints in plastic thin small outline package[J].Journal of Applied Physiology,1996,35:515.
[26] 肖克来提,盛玫,罗乐.等温时效对SnAg/Cu表面贴装焊点微结构及剪切强度的影响[J].金属学报,2000(07):697-702.
[27] Abtew M;Selvaduray G.Lead-free solders in microelectronics[J].Materials Science and Engineering,2000:95.
[28] Chuang CM.;Lui TS.;Chen LH. .Effect of aluminum addition on tensile properties of naturally aged Sn-9Zn eutectic solder[J].Journal of Materials Science,2002(1):191-195.
[29] Tu P.L.;Chan Y.C. .Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints[J].IEEE transactions on components, packaging, and manufacturing technology.Part B.Advanced packaging,1997(1):87-93.
[30] Pratt R.E.;Stromswold E.I. .Effect of solid-state intermetallic growth on the fracture toughness of Cu/63Sn-37Pb solder joints[J].IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A,1996(1):134-141.
[31] Ronka K J;Vanloof J J;Kivilahti J K .A diffusion-kinetic model for predicting solder/conductor interactions in high density interconnections[J].Metallurgical and Materials Transactions A:Physical Metallurgy and Materials Science,1998,29:2951.
[32] 王莉,祖丽君,方洪渊,钱乙余,丁克俭.锡铅稀土钎料合金高温蠕变性能试验研究[J].电子工艺技术,1999(03):87-89.
[33] 马鑫,钱乙余,Yoshida F.镧对Cu6Sn5长大驱动力及焊点可靠性的影响[J].中国稀土学报,2001(04):354-356.
[34] Loomans M E;Vaynman S;Ghosh G et al.Investigation of multi-component lead-free solders[J].Journal of Electronic Materials,1994,23(08):741.
[35] 傅献彩.物理化学[M].北京:人民教育出版社,1980:243.
[36] 薛松柏,赵振清,钱乙余,赵志成,王金玉,丁克俭.无铅钎料的超电势问题研究[J].焊接学报,1999(03):175-180.
[37] Gan H;Choi W J;Xu G.Electromigrationin solderjoints and solderlines[J].Journal of Electronic Materials,2002:30.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%