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铜电极在KCl电解质溶液中的电化学腐蚀已有循环伏和红外光谱电化学研究,然而,腐蚀过程的动力学和机理还不十分清楚.本文以SCILAB自由软件编程的元胞自动机方法模拟了该腐蚀过程的动力学,与实验结果一致,结合红外光谱、量子化学计算结果,进一步在分子尺度上探讨铜在实验条件下的腐蚀过程的机理:腐蚀动力学曲线在较短时间(〈200S)内符合Weibull规律,较长时间(〉200S)遵循Hoerl关系.

The electrochemical corrosion of copper in KCl solution has been studied by cyclic voltammetry and in situ IR spectroelectrochemistry, but the relevant kinetic and mechanism were still kept unknown. In the present paper, the corrosion kinetics was studied by means of cellular automat simulation on PC computer with SCILAB program. The simulation results are correlated well with the experimental data. The total corrosion dynamic curve follows a Weibull function in the short corrosion time(〈200 s), and a Hoerl function in the longer corrosion time(〉200 s), which is similar to the cellular automat simulation results in the literature. Based on the experimental, theoretical and simulation results, the mechanism of the corrosion process was suggested, which offers a new way to understand the process.

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