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微量铅在目前的无铅工艺生产制造过程中广泛存在,并可对无铅钎料组织性能产生重要影响.运用X射线衍射仪、扫描电镜及其附属能谱仪、超微硬度测试仪等仪器设备,研究微量铅对Sn9Zn钎料组织及微米压痕性能影响.结果表明:不同含量的Pb能使Sn9Zn钎料组织得到细化;当Pb的质量分数达到0.8%时,相比Sn9Zn钎料,压痕深度相对下降12%,压痕硬度增大22%,达到0.31GPa,钎料蠕变性能得到改善.

参考文献

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[4] KIL-WON MOON;WILLIAM J.BOETTINGER;URSULA R. KATTNER;CAROL A.HANDWERKER;DOH-JAE LEE .The Effect of Pb Contamination on theSolidification Behavior of Sn-Bi Solders[J].Journal of Electronic Materials,2001(1):45-52.
[5] Atso Forsten;Hector Steen;Ian Wilding;Jurgen Friedrich .Development and validation of lead-free wave soldering process[J].Soldering & Surface Mount Technology,2000(3):29-34.
[6] 李小蕴,吴炜,陈红圣,祖方遒.Sn-Bi系无铅焊料熔体结构转变及其对凝固组织及润湿性的影响[J].金属功能材料,2010(06):36-39.
[7] D.Q. Yu;H.P. Xie;L. Wang .Investigation of interfacial microstructure and wetting property of newly developed Sn-Zn-Cu solders with Cu substrate[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2004(1/2):119-125.
[8] R.A. Islam;B.Y. Wu;M.O. Alam .Investigations on microhardness of Sn-Zn based lead-free solder alloys as replacement of Sn-Pb solder[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2005(1/2):149-158.
[9] 闵文锦,宣天鹏.锡基无铅电子焊料的研究进展与发展趋势[J].金属功能材料,2009(02):55-59.
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