随着大规模集成电路的发展,需要一种高介质材料来代替传统的SiO2,介绍了有可能替代SiO2的几种二元材料的研究现状,主要包括Si3N4、Ta2O5、TiO2、ZrO2、Y2O3、Gd2O3和CeO2几种材料的结构和电学性能,以及制备薄膜的几种方法:蒸发法、化学气相沉积和离子束沉积.
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